| 11990391 |
Semiconductor device |
Shota Yoshikawa |
2024-05-21 |
| 11973432 |
Power conversion apparatus |
Hiromi Ichijyo, Yuu Yamahira, Kazuya Takeuchi, Masanori Sakata |
2024-04-30 |
| 11973433 |
Power conversion apparatus |
Hiromi Ichijyo, Yuu Yamahira, Kazuya Takeuchi, Masanori Sakata |
2024-04-30 |
| 11545419 |
Semiconductor package having an additional material with a comparative tracking index (CTI) higher than that of encapsulant resin material formed between two terminals |
Takuya Kadoguchi, Takahiro HIRANO, Arata Harada, Tomomi Okumura, Keita FUKUTANI |
2023-01-03 |
| 10985636 |
Semiconductor device |
Nobumasa Ueda, Hiroki Kiyose |
2021-04-20 |
| 10797569 |
Semiconductor device |
Nobumasa Ueda, Hiroki Kiyose |
2020-10-06 |
| 10103090 |
Semiconductor device |
Takuya Kadoguchi, Takahiro HIRANO, Takanori Kawashima, Keita FUKUTANI, Tomomi Okumura |
2018-10-16 |
| 9831160 |
Semiconductor device |
Takuya Kadoguchi, Takahiro HIRANO, Takanori Kawashima, Tomomi Okumura |
2017-11-28 |
| 9711884 |
Terminal connection structure and semiconductor apparatus |
Takuya Kadoguchi, Arata Harada, Takahiro HIRANO, Keita FUKUTANI, Tomomi Okumura |
2017-07-18 |
| 9406593 |
Lead frame, electric power converting device, semiconductor apparatus and method of manufacturing semiconductor apparatus |
Takuya Kadoguchi, Takahiro HIRANO, Arata Harada, Tomomi Okumura |
2016-08-02 |
| 9224662 |
Semiconductor apparatus |
Takuya Kadoguchi, Takahiro HIRANO, Tomomi Okumura, Keita FUKUTANI |
2015-12-29 |
| 9070666 |
Semiconductor device including cooler |
Kuniaki Mamitsu, Takahisa Kaneko, Masaya Tonomoto, Hiroyuki Wado, Chikage Noritake +2 more |
2015-06-30 |
| 8994167 |
Semiconductor device |
Takuya Kadoguchi, Shingo Iwasaki, Tomohiro Miyazaki, Tomomi Okumura |
2015-03-31 |
| 8957517 |
Semiconductor device including cooler |
Kuniaki Mamitsu, Takahisa Kaneko, Masaya Tonomoto, Hiroyuki Wado, Chikage Noritake +2 more |
2015-02-17 |
| 8884411 |
Semiconductor device and manufacturing method thereof |
Takuya Kadoguchi, Shingo Iwasaki, Takanori Kawashima, Tomomi Okumura |
2014-11-11 |
| 8884426 |
Semiconductor device including cooler |
Kuniaki Mamitsu, Takahisa Kaneko, Masaya Tonomoto, Hiroyuki Wado, Chikage Noritake +2 more |
2014-11-11 |
| 8558375 |
Semiconductor package cooled by grounded cooler |
Kuniaki Mamitsu, Takahisa Kaneko, Masaya Tonomoto, Hiroyuki Wado, Chikage Noritake +2 more |
2013-10-15 |
| 8497572 |
Semiconductor module and method of manufacturing the same |
Keita FUKUTANI, Kuniaki Mamitsu, Yasushi Ookura, Hiroyuki Wado, Syun Sugiura |
2013-07-30 |
| 8441122 |
Semiconductor device having semiconductor chip and metal plate |
Daisuke Fukuoka, Takanori Teshima, Kuniaki Mamitsu, Ken Sakamoto, Tetsuo Fujii +2 more |
2013-05-14 |
| 8405194 |
Semiconductor device including two heat sinks and method of manufacturing the same |
Yasushi Ookura |
2013-03-26 |