MM

Masamitsu Matasuura

TI Texas Instruments: 1 patents #7,357 of 12,488Top 60%
📍 Beppu, JP: #39 of 60 inventorsTop 65%
Overall (All Time): #2,549,415 of 4,157,543Top 65%
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12154861 Frame design in embedded die package Woochan Kim, Mutsumi Masumoto, Kengo Aoya, Hau Nguyen, Vivek Kishorechand Arora +2 more 2024-11-26