Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12272614 | Integrated circuit packages with solder thermal interface materials with embedded particles | Amitesh Saha, Sergio Antonio Chan Arguedas, Ken Hackenberg, Peng Li | 2025-04-08 |
| 12062592 | Integrated circuit packages with thermal interface materials with different material compositions | Sergio Antonio Chan Arguedas, Amitesh Saha, Ken Hackenberg, Emilio Tarango Valles | 2024-08-13 |
| 11670569 | Channeled lids for integrated circuit packages | Manish Dubey, Amitesh Saha, Peng Li, Bamidele Daniel Falola | 2023-06-06 |