| 12237245 |
Face-to-face through-silicon via multi-chip semiconductor apparatus with redistribution layer packaging and methods of assembling same |
Choong Kooi Chee |
2025-02-25 |
| 12125768 |
Face-to-face through-silicon via multi-chip semiconductor apparatus with redistribution layer packaging and methods of assembling same |
Choong Kooi Chee |
2024-10-22 |
| 11805602 |
Chip assemblies |
Choong Kooi Chee, Teong Guan Yew |
2023-10-31 |
| 11562959 |
Embedded dual-sided interconnect bridges for integrated-circuit packages |
Teong Guan Yew, Choong Kooi Chee |
2023-01-24 |
| 11527481 |
Stacked semiconductor package with flyover bridge |
Choong Kooi Chee, Bok Eng Cheah, Teong Guan Yew, Jackson Chung Peng Kong |
2022-12-13 |
| 11393758 |
Power delivery for embedded interconnect bridge devices and methods |
Bok Eng Cheah, Jackson Chung Peng Kong, Wai Ling Lee |
2022-07-19 |
| 11107751 |
Face-to-face through-silicon via multi-chip semiconductor apparatus with redistribution layer packaging and methods of assembling same |
Choong Kooi Chee |
2021-08-31 |
| 9978735 |
Interconnection of an embedded die |
Choong Kooi Chee, Mei See Chin, Wai Ling Lee, Wei Lun Oo |
2018-05-22 |
| 9842181 |
Method to optimize general-purpose input/output interface pad assignments for integrated circuit |
Kyung Suk Oh, Yee Huan Yew, Chee Cheong Tan, Mei See Chin, Wai Ling Lee +2 more |
2017-12-12 |
| 7081772 |
Optimizing logic in non-reprogrammable logic devices |
— |
2006-07-25 |