Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6824448 | CMP polisher substrate removal control mechanism and method | Parker A. Wood, Paul Douglas, Jesse Guzman | 2004-11-30 |
| 6444502 | Method for forming strapless anti-fuse structure | Ivan Sanchez, Danny Echtle | 2002-09-03 |
| 6429144 | Integrated circuit manufacture method with aqueous hydrogen fluoride and nitric acid oxide etch | Felix Fujishiro, Yu-Pin Han | 2002-08-06 |
| 6346032 | Fluid dispensing fixed abrasive polishing pad | Liming Zhang, Andrew J. Black | 2002-02-12 |
| 6331136 | CMP pad conditioner arrangement and method therefor | Victor J. Bass | 2001-12-18 |
| 6302771 | CMP pad conditioner arrangement and method therefor | Albert H. Liu | 2001-10-16 |
| 6077151 | Temperature control carrier head for chemical mechanical polishing process | Andrew J. Black | 2000-06-20 |
| 6048789 | IC interconnect formation with chemical-mechanical polishing and silica etching with solution of nitric and hydrofluoric acids | Craig A. Bellows, Walter D. Parmantie | 2000-04-11 |
| 6016001 | Metal to amorphous silicon to metal anti-fuse structure | Ivan Sanchez, Danny Echtle | 2000-01-18 |
| 6007641 | Integrated-circuit manufacture method with aqueous hydrogen-fluoride and nitric-acid oxide etch | Felix Fujishiro, Yu-Pin Han | 1999-12-28 |
| 5989948 | Methods of forming pairs of transistors, and methods of forming pairs of transistors having different voltage tolerances | Hunter B. Brugge | 1999-11-23 |
| 5899707 | Method for making doped antifuse structures | Ivan Sanchez | 1999-05-04 |
| 5745990 | Titanium boride and titanium silicide contact barrier formation for integrated circuits | Chang-Ou Lee, Felix Fujishiro, Sigmund Koenigseder | 1998-05-05 |
| 5728602 | Semiconductor wafer manufacturing process with high-flow-rate low-pressure purge cycles | Craig A. Bellows | 1998-03-17 |
| 5610105 | Densification in an intermetal dielectric film | Sigmund Koenigseder, John L. Cain, Chang-Ou Lee, Felix Fujishiro | 1997-03-11 |
| 5493926 | Method of identifying a weakest interface where delamination is most likely to occur in a multi-layer dielectric film stack | Felix Fujishiro, Danny Echtle, Annette Garcia | 1996-02-27 |
| 5434104 | Method of using corrosion prohibiters in aluminum alloy films | John L. Cain, Sigmund Koenigseder, Chang-Ou Lee, Felix Fujishiro | 1995-07-18 |
| 5329161 | Molybdenum boride barrier layers between aluminum and silicon at contact points in semiconductor devices | John L. Cain, Chang-Ou Lee, Sigmund Koenigseder, Felix Fujishiro | 1994-07-12 |
| 5294571 | Rapid thermal oxidation of silicon in an ozone ambient | Felix Fujishiro, Chang-Ou Lee | 1994-03-15 |
| 5286518 | Integrated-circuit processing with progressive intermetal-dielectric deposition | John L. Cain, Felix Fujishiro, Chang-Ou Lee, Sigmund Koenigseder | 1994-02-15 |