Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9793309 | Image sensor package | Byoung-Rim Seo, Yoon Young CHOI, Chang-soo Jin, Seung-Kon Mok, Tae-weon Suh +1 more | 2017-10-17 |
| 9730323 | Semiconductor package | Jin-Gyu Kim, Jung Woo Kim, Tae Hun Kim | 2017-08-08 |
| 9570400 | Semiconductor package | Bo-Na Baek, Seok-Won Lee, Eun-Seok Cho, Dong-Han Kim, Sa-Yoon Kang | 2017-02-14 |
| 9230876 | Stack type semiconductor package | Jang-woo Lee, Jong Bo Shim | 2016-01-05 |
| 8796158 | Methods for forming circuit pattern forming region in an insulating substrate | — | 2014-08-05 |
| 8648478 | Flexible heat sink having ventilation ports and semiconductor package including the same | Jae-Wook Yoo, Eun-Seok Cho, Mi-Na Choi, Hee-Jung Hwang, Se-Ran Bae | 2014-02-11 |
| 8629547 | Semiconductor chip package | Kyong-Soon Cho, Chang-Su Kim, Kwan-Jai Lee, Jae-Hyok Ko, Keung Beum Kim | 2014-01-14 |
| 8575746 | Chip on flexible printed circuit type semiconductor package | Si-Hoon Lee, Sa-Yoon Kang | 2013-11-05 |
| 8513781 | Device for removing electromagnetic interference and semiconductor package including the same | Jae-Wook Yoo, Yun-Seok Choi | 2013-08-20 |
| 8266796 | Method of fabricating a semiconductor device package | Ji-Yong Park | 2012-09-18 |
| 8250750 | Method for manufacturing tape wiring board | Sa-Yoon Kang, Yong-Hwan Kwon, Chung-Sun Lee | 2012-08-28 |
| 8222089 | Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same | Byung-Seo Kim, Young-jae Joo, Ye-Chung Chung, Kyong-Soon Cho, Sang-Heui Lee +6 more | 2012-07-17 |
| 8110918 | Flexible substrate for a semiconductor package, method of manufacturing the same, and semiconductor package including flexible substrate | — | 2012-02-07 |
| 7956452 | Flip chip packages | Yun-Seok Choi, Hee-Seok Lee | 2011-06-07 |
| 7915727 | Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same | Byung-Seo Kim, Young-jae Joo, Ye-Chung Chung, Kyong-Soon Cho, Sang-Heui Lee +6 more | 2011-03-29 |
| 7895742 | Method for manufacturing tape wiring board | Sa-Yoon Kang, Yong-Hwan Kwon, Chung-Sun Lee | 2011-03-01 |
| 7888237 | Method of cutting semiconductor wafer, semiconductor chip apparatus, and chamber to cut wafer | Dong-Han Kim, Chul Woo Kim | 2011-02-15 |
| 7534645 | CMOS type image sensor module having transparent polymeric encapsulation material | — | 2009-05-19 |
| 7299547 | Method for manufacturing tape wiring board | Sa-Yoon Kang, Yong-Hwan Kwon, Chung-Sun Lee | 2007-11-27 |
| 7190073 | Circuit film with bump, film package using the same, and related fabrication methods | Yong-Hwan Kwon, Sa-Yoon Kang, Chung-Sun Lee | 2007-03-13 |
| 7105904 | CMOS type image sensor module having transparent polymeric encapsulation material | — | 2006-09-12 |