Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021068 | Semiconductor device with dummy thermal features on interposer | Bo-Jiun Yang, Wen-Sung Hsu, Tai-Yu Chen, Shih-Chin Lin | 2024-06-25 |
| 10103128 | Semiconductor package incorporating redistribution layer interposer | Che-Ya Chou, Chia-Hao Yang, Nan-Cheng Chen | 2018-10-16 |
| 8089164 | Substrate having optional circuits and structure of flip chip bonding | Ko-Wei Lin, Yun-Hsiang Tien | 2012-01-03 |