Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266598 | Dense via pitch interconnect to increase wiring density | Francesco Preda, Sungjun Chun, Jose A. Hejase, Pavel Roy Paladhi, Nam H. Pham +2 more | 2025-04-01 |
| 11658378 | Vertically transitioning between substrate integrated waveguides (SIWs) within a multilayered printed circuit board (PCB) | Joshua C. Myers, Jose A. Hejase, Pavel Roy Paladhi, Wiren D. Becker, Sungjun Chun +1 more | 2023-05-23 |
| 11399428 | PCB with substrate integrated waveguides using multi-band monopole antenna feeds for high speed communication | Pavel Roy Paladhi, Jose A. Hejase, Joshua C. Myers, Sungjun Chun, Wiren D. Becker +1 more | 2022-07-26 |
| 10879575 | Embedded filtering in PCB integrated ultra high speed dielectric waveguides using photonic band gap structures | Joshua C. Myers, Jose A. Hejase, Daniel M. Dreps | 2020-12-29 |
| 10199706 | Communication system having a multi-layer PCB including a dielectric waveguide layer with a core and cladding directly contacting ground planes | Samuel R. Connor, Daniel M. Dreps, Jose A. Hejase, Joseph Kuczynski, Joshua C. Myers | 2019-02-05 |
| 10181628 | Reduction of crosstalk between dielectric waveguides using split ring resonators | Daniel M. Dreps, Jose A. Hejase, Joshua C. Myers | 2019-01-15 |
| 10141623 | Multi-layer printed circuit board having first and second coaxial vias coupled to a core of a dielectric waveguide disposed in the circuit board | Samuel R. Connor, Jose A. Hejase, Joseph Kuczynski, Joshua C. Myers | 2018-11-27 |