Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8569870 | Integrated circuit packaging system with shielding spacer and method of manufacture thereof | SinJae Lee, Sung Jun Yoon, JiHoon Oh | 2013-10-29 |
| 8310038 | Integrated circuit packaging system with embedded conductive structure and method of manufacture thereof | JinGwan Kim, KyuWon Lee, JiHoon Oh | 2012-11-13 |
| 8004093 | Integrated circuit package stacking system | JiHoon Oh, JinGwan Kim, Jaehyun LIM, SunYoung Chun, KyuWon Lee +1 more | 2011-08-23 |
| 7683469 | Package-on-package system with heat spreader | JiHoon Oh, KyuWon Lee, Jaehyun LIM, SinJae Lee | 2010-03-23 |