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Thermoplastic adhesive preform for heat sink attachment |
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Universal tool for uniformly applying a force to a plurality of components on a circuit board |
James Westcott Heater, Allen Thomas Mays |
2006-12-19 |
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Thermoplastic adhesive preform for heat sink attachment |
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2005-05-17 |
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Method and composition for mounting an electronic component and device formed therewith |
Joseph D. Poole, Kris A. Slesinger, Michael C. Weller |
2003-07-08 |
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Method and composition for mounting an electronic component and device formed therewith |
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2003-07-08 |
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Transfer fluxing method and apparatus for component placement on substrate |
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2002-10-29 |
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Thermoplastic adhesive preform for heat sink attachment |
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2002-08-13 |
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2001-12-25 |
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Method and apparatus for soldering ball grid array modules to substrates |
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Universal tool for uniformly applying a force to a plurality of components on a circuit board |
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Transfer fluxing method and apparatus for component placement on substrate |
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2000-03-21 |
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Wire mesh insert for thermal adhesives |
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Method and apparatus for soldering ball grid array modules to substrates |
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Particle spacing and metering device |
— |
1981-03-10 |