Issued Patents All Time
Showing 25 most recent of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11641742 | Memory arrays and methods used in forming a memory array comprising strings of memory cells | Cole Smith, Ramey M. Abdelrahaman, Silvia Borsari, Chris M. Carlson, David Daycock +1 more | 2023-05-02 |
| 11152388 | Memory arrays and methods used in forming a memory array comprising strings of memory cells | Cole Smith, Ramey M. Abdelrahaman, Silvia Borsari, Chris M. Carlson, David Daycock +1 more | 2021-10-19 |
| 11011420 | Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods | Hongqi Li, Anurag Jindal, Shyam Ramalingam | 2021-05-18 |
| 10847442 | Interconnect assemblies with through-silicon vias and stress-relief features | Hongqi Li, Anurag Jindal, Gowrisankar Damarla, Shyam Ramalingam | 2020-11-24 |
| 10567387 | Systems and methods for managing computing device access to local area computer networks | Charles Trinh, Hilario Acevedo, Marco Alvarado | 2020-02-18 |
| 10567962 | Systems and methods for connecting internet-connected devices to wireless access points | — | 2020-02-18 |
| 10546777 | Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods | Hongqi Li, Anurag Jindal, Shyam Ramalingam | 2020-01-28 |
| 10516570 | Systems and methods for tagging client devices | Ramakrishnan Meenakshi Sundaram | 2019-12-24 |
| 10403575 | Interconnect structure with nitrided barrier | Gregory Herdt, Mikhail A. Treger | 2019-09-03 |
| 10319678 | Capping poly channel pillars in stacked circuits | Hongqi Li, Gowrisankar Damarla, Roger W. Lindsay, Zailong Bian, Shyam Ramalingam +1 more | 2019-06-11 |
| 10163655 | Through substrate via liner densification | Rita J. Klein, Diem Thy N. Tran, Irina Vasilyeva, Zhiqiang Xie | 2018-12-25 |
| 9922875 | Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods | Hongqi Li, Anurag Jindal, Shyam Ramalingam | 2018-03-20 |
| 9911643 | Semiconductor constructions and methods of forming intersecting lines of material | Hongqi Li, Gowrisankar Damarla, Robert J. Hanson, Shyam Ramalingam | 2018-03-06 |
| 9911653 | Low capacitance interconnect structures and associated systems and methods | Hongqi Li, Kevin J. Torek, Thy Tran, Alex J. Schrinsky | 2018-03-06 |
| 9800610 | Systems and methods for defeating relay attacks | — | 2017-10-24 |
| 9754825 | Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods | Hongqi Li, Anurag Jindal, Shyam Ramalingam | 2017-09-05 |
| 9613864 | Low capacitance interconnect structures and associated systems and methods | Hongqi Li, Kevin J. Torek, Thy Tran, Alex J. Schrinsky | 2017-04-04 |
| 9577192 | Method for forming a metal cap in a semiconductor memory device | Muralikrishnan Balakrishnan, Zailong Bian, Gowrisankar Damarla, Hongqi Li, Shyam Ramalingam +1 more | 2017-02-21 |
| 9572034 | Systems and methods for securing wireless networks | — | 2017-02-14 |
| 9391001 | Semiconductor constructions | Hongqi Li, Gowrisankar Damarla, Robert J. Hanson, Shyam Ramalingam | 2016-07-12 |
| 9263459 | Capping poly channel pillars in stacked circuits | Hongqi Li, Gowrisankar Damarla, Roger W. Lindsay, Zailong Bian, Shyam Ramalingam +1 more | 2016-02-16 |
| 9252989 | Data-dependent equalizer circuit | Shaohua Yang, Weijun Tan | 2016-02-02 |
| 9153451 | Method of forming a planar surface for a semiconductor device structure, and related methods of forming a semiconductor device structure | Andrew Carswell, Wayne H. Huang, Siddartha Kondoju, Suresh Ramakrishnan, Kozaburo Sakai +2 more | 2015-10-06 |
| 9147416 | Systems and methods for multi-head servo data processing | Jeffrey P. Grundvig, Richard Rauschmayer, Yu-Te Liao, Edward J. D'Avignon | 2015-09-29 |
| 9099132 | Systems and methods for multi-head separation determination | Jeffrey P. Grundvig, Richard Rauschmayer | 2015-08-04 |