| 6667560 |
Board on chip ball grid array |
— |
2003-12-23 |
| 6387729 |
Method for adhering and sealing a silicon chip in an integrated circuit package |
Kian Teng Eng, Min Yu Chan, Siu Waf Low, Boon Pew Chan, Tuck Fook Toh +2 more |
2002-05-14 |
| 6365833 |
Integrated circuit package |
Kian Teng Eng, Min Yu Chan, Siu Waf Low, Boon Pew Chan, Tuck Fook Toh +2 more |
2002-04-02 |
| 6316829 |
Reinforced semiconductor package |
Suan Boon |
2001-11-13 |
| 6236107 |
Encapsulate resin LOC package and method of fabrication |
Min Yu Chan, Siu Waf Low |
2001-05-22 |
| 6177723 |
Integrated circuit package and flat plate molding process for integrated circuit package |
Kian Teng Eng, Min Yu Chan, Boon Pew Chan |
2001-01-23 |
| 6087203 |
Method for adhering and sealing a silicon chip in an integrated circuit package |
Kian Teng Eng, Min Yu Chan, Siu Waf Low, Boon Pew Chan, Tuck Fook Toh +2 more |
2000-07-11 |
| 6040623 |
Slotted lead for a semiconductor device |
Min Yu Chan |
2000-03-21 |
| 5952611 |
Flexible pin location integrated circuit package |
Kian Teng Eng, Min Yu Chan, Siu Waf Low |
1999-09-14 |
| 5798564 |
Multiple chip module apparatus having dual sided substrate |
Kian Teng Eng |
1998-08-25 |
| 5647124 |
Method of attachment of a semiconductor slotted lead to a substrate |
Min Yu Chan |
1997-07-15 |
| 5529474 |
System for preheating a molding compound |
Chee C. Lau |
1996-06-25 |