Issued Patents All Time
Showing 25 most recent of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10306778 | Printed circuit board with dam around cavity and manufacturing method thereof | Jae Ean LEE, Young Gwan Ko, Soon-Oh Jung, Kyung Hwan Ko, Yong Ho Baek | 2019-05-28 |
| 10045444 | Printed circuit board, package and method of manufacturing the same | Jae Ean LEE, Young Gwan Ko, Kyung Hwan Ko, Yong Ho Baek | 2018-08-07 |
| 9999131 | Printed circuit board with embedded electronic component and manufacturing method thereof | Kyung Hwan Ko, Young Gwan Ko, Jae Ean LEE, Yong Ho Baek | 2018-06-12 |
| 9848492 | Printed circuit board and method of manufacturing the same | Jae Ean LEE, Young Gwan Ko, Soon-Oh Jung, Kyung Hwan Ko, Yong Ho Baek | 2017-12-19 |
| 8633396 | Die mounting substrate and method of fabricating the same | Eung-Suek Lee, Jun Oh Hwang | 2014-01-21 |
| 8592135 | Method of manufacturing printed circuit board | Je-Gwang Yoo, Eung-Suek Lee, Chang-Sup Ryu | 2013-11-26 |
| 8549744 | Printed circuit board using bump and method for manufacturing thereof | Hee-Bum Shin, Dong-Jin Park, Jong-Suk Bae, Ki Hwan Kim | 2013-10-08 |
| 8377748 | Method of manufacturing cooling fin and package substrate with cooling fin | Eung-Suek Lee, Je-Gwang Yoo, Chang-Sup Ryu, Jun Oh Hwang, Jun Heyoung Park | 2013-02-19 |
| 8298447 | Conductive paste, printed circuit board, and manufacturing method thereof | Ki Hwan Kim, Myung Sam Kang | 2012-10-30 |
| 8222534 | Printed circuit board and manufacturing method thereof | Jun Heyoung Park, Ki Hwan Kim, Sung Yong Kim | 2012-07-17 |
| 8220149 | Method of manufacturing a printed circuit board | Hee-Bum Shin, Jeong Ho Moon, Jae-Hyun Eom | 2012-07-17 |
| 8198550 | Printed circuit board and method of manufacturing the same | Je-Gwang Yoo, Chang-Sup Ryu | 2012-06-12 |
| 8166647 | Method of manufacturing a printed circuit board | Jun Oh Hwang, Jun Heyoung Park, Kyung Ah Lee, Eung-Suek Lee | 2012-05-01 |
| 8161634 | Method of fabricating a printed circuit board | Jun Heyoung Park | 2012-04-24 |
| 8151446 | Apparatus for manufacturing printed circuit board | Je-Gwang Yoo, Yoong Oh, Jong Seok Bae, Chang-Sup Ryu | 2012-04-10 |
| 8058558 | Printed circuit board and manufacturing method thereof | Dong-Jin Park, Jun Heyoung Park, Ki Hwan Kim, Sung Young Kim | 2011-11-15 |
| 7973248 | Printed circuit board using paste bump and manufacturing method thereof | Chang-Sup Ryu, Eung-Suek Lee, Youn-Soo Seo, Hee-Bum Shin, Yoong Oh +3 more | 2011-07-05 |
| 7901985 | Method for manufacturing package on package with cavity | Chang-Sup Ryu, Dong-Jin Park | 2011-03-08 |
| 7859106 | Multilayer printed circuit board using paste bumps | Yoong Oh, Chang-Sup Ryu, Dong-Jin Park, Byung-Bae Seo | 2010-12-28 |
| 7841074 | Method of fabricating paste bump for printed circuit board | Jun Heyoung Park, Ki Hwan Kim, Sung Yong Kim, Sang Hyun Park | 2010-11-30 |
| 7836590 | Manufacturing method for printed circuit board | Jun Heyoung Park | 2010-11-23 |
| 7653991 | Method for manufacturing printed circuit board having embedded component | Jun Heyoung Park, Ki Hwan Kim, Sung Yong Kim | 2010-02-02 |
| 7622329 | Method for fabricating core substrate using paste bumps | Yoong Oh, Chang-Sup Ryu, Dong-Jin Park, Byung-Bae Seo | 2009-11-24 |
| 7605459 | Coreless substrate and manufacturing thereof | Chang-Sup Ryu, Dong-Jin Park | 2009-10-20 |
| 7435352 | Method of forming solder resist pattern | Jang-Kyu Kang, Chang-Hyun Nam | 2008-10-14 |