Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6531083 | Sproutless pre-packaged molding for component encapsulation | Mario A. Bolanos, George A. Bednarz, Tay LiangChee, Julius Lim, Ireneus J. T. M. Pas | 2003-03-11 |
| 5965078 | Method for manufacturing prepackaged molding compound for component encapsulation | Mario A. Bolanos, Tay Liang Chee, Ireneus J. T. M. Pas | 1999-10-12 |
| 5955115 | Pre-packaged liquid molding for component encapsulation | Mario A. Bolanos, George A. Bednarz | 1999-09-21 |
| 5949132 | Dambarless leadframe for molded component encapsulation | Raymond A. Frechette, Mario A. Bolanos, Ireneus J. T. M. Pas | 1999-09-07 |
| 5912024 | Sproutless pre-packaged molding for component encapsulation | Mario A. Bolanos, George A. Bednarz, Tay LiangChee, Julius Lim, Ireneus J. T. M. Pas | 1999-06-15 |
| 5891377 | Dambarless leadframe for molded component encapsulation | Raymond A. Frechette, Mario A. Bolanos, Ireneus J. T. M. Pas | 1999-04-06 |
| 5888443 | Method for manufacturing prepackaged molding compound for component encapsulation | Mario A. Bolanos, Tay Liang Chee, Ireneus J. T. M. Pas | 1999-03-30 |
| 5885506 | Pre-packaged molding for component encapsulation | Mario A. Bolanos, Julius Lim, Tay Liang Chee, Ireneus J. T. M. Pas | 1999-03-23 |