| 5920125 |
Interconnection of a carrier substrate and a semiconductor device |
Joseph Funari, Jack A. Varcoe |
1999-07-06 |
| 5859470 |
Interconnection of a carrier substrate and a semiconductor device |
Joseph Funari, Jack A. Varcoe |
1999-01-12 |
| 5669137 |
Method of making electronic package assembly with protective encapsulant material |
Richard Joseph Noreika, Jack A. Varcoe |
1997-09-23 |
| 5553769 |
Interconnection of a carrier substrate and a semiconductor device |
Joseph Funari, Jack A. Varcoe |
1996-09-10 |
| 5469333 |
Electronic package assembly with protective encapsulant material on opposing sides not having conductive leads |
Richard Joseph Noreika, Jack A. Varcoe |
1995-11-21 |
| 5414928 |
Method of making an electronic package assembly with protective encapsulant material |
Barry A. Bonitz, Kishen N. Kapur, Jack M. McCreary, Irving Memis, Gerald M. Vettel |
1995-05-16 |
| 5252179 |
Apparatus and method for selectively etching a plastic encapsulating material |
Louis J. Konrad, III, Ronald J. Moore, Jack A. Varcoe |
1993-10-12 |
| 4690833 |
Providing circuit lines on a substrate |
William A. Donson, Richard B. Hammer, William Lafer, Keith A. Snyder |
1987-09-01 |
