Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8415044 | Label indicating exposure to moisture attached to molded battery case | Ki eob Moon, Seog Jin YOON, Cheol-Woong Lee | 2013-04-09 |
| 8368231 | Chipstack package and manufacturing method thereof | Kang-Wook Lee, Gu-Sung Kim, Dong-Hyeon Jang, Seung-Duk Baek | 2013-02-05 |
| 8206849 | Integral cap assembly having protective circuit module, and secondary battery comprising the same | Hyungchan Kim, Hee Gyu Kim, Yong Ho Cho | 2012-06-26 |
| 7985501 | Integral cap assembly having protective circuit module, and secondary battery comprising the same | Hyungchan Kim, Hee Gyu Kim, Yong Ho Cho | 2011-07-26 |
| 7977156 | Chipstack package and manufacturing method thereof | Kang-Wook Lee, Gu-Sung Kim, Dong-Hyeon Jang, Seung-Duk Baek | 2011-07-12 |
| 7855144 | Method of forming metal lines and bumps for semiconductor devices | Soon-Bum Kim, Sung-Min Sim, Dong-Hyeon Jang, Se-Yong Oh | 2010-12-21 |
| 7828859 | Method for manufacturing a battery having a battery after service label, and a battery manufactured by the method | Ki eob Moon, Seog Jin YOON, Cheol-Woong Lee | 2010-11-09 |
| 7648797 | Unification type cap assembly containing protection circuit board and secondary battery comprising the same | Hyungchan Kim, Hee Gyu Kim, Yong Ho Cho | 2010-01-19 |
| 7537959 | Chip stack package and manufacturing method thereof | Kang-Wook Lee, Gu-Sung Kim, Dong-Hyeon Jang, Seung-Duk Baek | 2009-05-26 |
| 7312143 | Wafer level chip scale package having a gap and method for manufacturing the same | Myeong-Soon Park, Hyun-Soo Chung, In-Young Lee, Sung-Min Sim, Dong-Hyeon Jang +2 more | 2007-12-25 |
| 7307340 | Wafer-level electronic modules with integral connector contacts | Seung-Duk Baek, Dong-Hyeon Jang, Gu-Sung Kim, Kang-Wook Lee | 2007-12-11 |
| 7276799 | Chip stack package and manufacturing method thereof | Kang-Wook Lee, Gu-Sung Kim, Dong-Hyeon Jang, Seung-Duk Baek | 2007-10-02 |
| 7205660 | Wafer level chip scale package having a gap and method for manufacturing the same | Myeong-Soon Park, Hyun-Soo Chung, In-Young Lee, Sung-Min Sim, Dong-Hyeon Jang +2 more | 2007-04-17 |
| 6692874 | Electrolytes and lithium ion battery using the same | Hyeong Jin Kim, Seung-II Yoo | 2004-02-17 |