Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842991 | Semiconductor device and method of forming a 3D interposer system-in-package module | DeokKyung Yang, OhHan Kim, HeeSoo Lee, HunTeak Lee, Il Kwon Shim | 2023-12-12 |
| 11715703 | EMI shielding for flip chip package with exposed die backside | SungWon Cho, ChangOh Kim, Il Kwon Shim, KyoungHee Park | 2023-08-01 |
| 11342278 | EMI shielding for flip chip package with exposed die backside | SungWon Cho, ChangOh Kim, Il Kwon Shim, KyoungHee Park | 2022-05-24 |
| 11309193 | Semiconductor device and method of forming SIP module over film layer | OhHan Kim, Kyunghwan KIM, WoonJae Beak, HunTeak Lee | 2022-04-19 |
| 10804119 | Method of forming SIP module over film layer | OhHan Kim, Kyunghwan KIM, WoonJae Beak, HunTeak Lee | 2020-10-13 |
| 10804217 | EMI shielding for flip chip package with exposed die backside | SungWon Cho, ChangOh Kim, Il Kwon Shim, KyoungHee Park | 2020-10-13 |
| 10797039 | Semiconductor device and method of forming a 3D interposer system-in-package module | DeokKyung Yang, OhHan Kim, HeeSoo Lee, HunTeak Lee, Il Kwon Shim | 2020-10-06 |
| 10629565 | Semiconductor device and method of forming SIP with electrical component terminals extending out from encapsulant | JinHee Jung, OhHan Kim | 2020-04-21 |
| 10418341 | Semiconductor device and method of forming SIP with electrical component terminals extending out from encapsulant | JinHee Jung, OhHan Kim | 2019-09-17 |
| 10388637 | Semiconductor device and method of forming a 3D interposer system-in-package module | OhHan Kim, DeokKyung Yang, HunTeak Lee, Il Kwon Shim | 2019-08-20 |
| 10319684 | Dummy conductive structures for EMI shielding | SeungYong Chai, Soyeon Park | 2019-06-11 |
| 9331007 | Semiconductor device and method of forming conductive ink layer as interconnect structure between semiconductor packages | Flynn Carson, Il Kwon Shim, SeongHun Mun | 2016-05-03 |