Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12249583 | Package structure, assembly structure and method for manufacturing the same | Syu-Tang Liu, Min-Lung Huang, Tsung-Tang Tsai, Ching-Ju Chen | 2025-03-11 |
| 12040261 | Substrate structure and method for manufacturing the same | Syu-Tang Liu, Tsung-Tang Tsai, Ching-Ju Chen | 2024-07-16 |
| 11894340 | Package structure and method for manufacturing the same | Syu-Tang Liu, Min-Lung Huang, Tsung-Tang Tsai, Ching-Ju Chen | 2024-02-06 |
| 11886015 | Recessed portion in a substrate and method of forming the same | Shao Hsuan CHUANG | 2024-01-30 |
| 11862585 | Semiconductor package structures and methods of manufacturing the same | Syu-Tang Liu, Shu-Han Yang | 2024-01-02 |
| 11848143 | Electronic device and method for manufacturing the same | Yunghsun Chen, Shao Hsuan CHUANG | 2023-12-19 |
| 11728282 | Package structure, assembly structure and method for manufacturing the same | Syu-Tang Liu, Min-Lung Huang, Tsung-Tang Tsai, Ching-Ju Chen | 2023-08-15 |
| 11631734 | Vertical capacitor structure having capacitor in cavity, and method for manufacturing the vertical capacitor structure | Syu-Tang Liu, Tsung-Tang Tsai, Hung-Jung Tu | 2023-04-18 |
| 11621229 | Wiring structure and method for manufacturing the same | Syu-Tang Liu | 2023-04-04 |
| 11581123 | Inductor and circuit structure and method of manufacturing the same | Syu-Tang Liu, Yunghsun Chen | 2023-02-14 |
| 11495557 | Semiconductor device and method of manufacturing the same | Jhao-Cheng CHEN, Wen-Long LU, Shao Hsuan CHUANG, Ching-Ju Chen, Tse-Chuan Chou | 2022-11-08 |
| 11410957 | Semiconductor package structure and method of manufacturing the same | Shao Hsuan CHUANG | 2022-08-09 |
| 11411073 | Semiconductor package device and method for manufacturing the same | Shao Hsuan CHUANG, Min-Lung Huang | 2022-08-09 |
| 11289411 | Substrate structure and method for manufacturing the same | Syu-Tang Liu, Tsung-Tang Tsai, Ching-Ju Chen | 2022-03-29 |
| 11262506 | Recessed portion in a substrate and method of forming the same | Shao Hsuan CHUANG | 2022-03-01 |
| 11215762 | Optical device package and method for manufacturing the same | Po Ju Wu, Yu-Cheng Chen, Wen-Long LU | 2022-01-04 |
| 11107881 | Semiconductor package devices having conductive layer, semiconductor wall, conductive wall, and insulation layer | Shao Hsuan CHUANG, Min-Lung Huang, Yu-Cheng Chen, Syu-Tang Liu | 2021-08-31 |
| 10847602 | Vertical capacitor structure having capacitor in cavity and method for manufacturing the same | Syu-Tang Liu, Tsung-Tang Tsai, Hung-Jung Tu | 2020-11-24 |
| 10796987 | Semiconductor device package and method of manufacturing the same | Wen-Long LU | 2020-10-06 |
| 10741483 | Substrate structure and method for manufacturing the same | Syu-Tang Liu, Tsung-Tang Tsai, Ching-Ju Chen | 2020-08-11 |
| 10344383 | Semiconductor package device and method of manufacturing the same | Chuan-Yung Shih, Tai-Yuan Huang, Yu-Chi Wang, Chin-Feng Wang, Sing-Syuan Shiau +3 more | 2019-07-09 |