Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9349645 | Apparatus, device and method for wafer dicing | Martin Lapke, Hartmut Buenning, Sascha Moeller, Guido Albermann, Thomas Rohleder | 2016-05-24 |
| 5878941 | Method of soldering components on a carrier foil | Reinhard Wendt | 1999-03-09 |