Issued Patents All Time
Showing 1–25 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12359013 | Curable composition | Jeong Hyun Lee, Do Yeon Kim, Yang Gu Kang, Shin Hee Jun, Ho Yeon Son | 2025-07-15 |
| 12220232 | Apparatus for controlling operations of continuous glucose monitoring system | Jin Won Lee, Choong Beom YOU, Hyo Seon PARK | 2025-02-11 |
| 11852647 | Method for predicting the rubber reinforcing effect of organic-inorganic composite for rubber reinforcement | Woo Seok Kim, Shin Hee Jun, Kwon Il Choi, Myounghwan Oh | 2023-12-26 |
| 11459444 | Inorganic composite for rubber reinforcement, method for preparing the same, and rubber composition for tires comprising the same | Shin Hee Jun, Kwon Il Choi, Woo Seok Kim, Myounghwan Oh | 2022-10-04 |
| 11091422 | Method for removing monohydric alcohol from esterification and method for preparing ester composition comprising same | Sung Kyu Lee, Joon Ho Shin, Hyoung Jun | 2021-08-17 |
| 11059956 | Organic-inorganic composite for rubber reinforcement, method for preparing the same, and rubber composition for tires comprising the same | Woo Seok Kim, Shin Hee Jun, Kwon Il Choi, Myounghwan Oh | 2021-07-13 |
| 10875980 | Reinforcing material for rubber comprising aluminosilicate particles and rubber composition for tires comprising the same | Shin Hee Jun, Kwon Il Choi, Woo Seok Kim, Han Nah Jeong, Myounghwan Oh | 2020-12-29 |
| 10829430 | Ester composition preparation system and ester composition preparation method using same | Sung Kyu Lee, Joon Ho Shin, Hyoung Jun, Hyun Kyu Kim | 2020-11-10 |
| 10815358 | Reinforcing material for rubber comprising aluminosilicate particles and rubber composition for tires comprising the same | Shin Hee Jun, Kwon Il Choi, Woo Seok Kim, Myounghwan Oh, Han Nah Jeong | 2020-10-27 |
| 10793441 | Method for preparing aluminosilicate particles having excellent dispersion, reinforcing material for rubber comprising the aluminosilicate particles, and rubber composition for tires comprising the reinforcing material | Kwon Il Choi, Woo Seok Kim, Shin Hee Jun, Myounghwan Oh | 2020-10-06 |
| 10766843 | Method for purifying phenol | Sung Kyun Kim, Sung Kyu Lee, Yeon Uk Choo, Joon Ho Shin, Tae Woo Kim | 2020-09-08 |
| 10689499 | Solvent separation apparatus and waste heat utilization method | Sung Kyu Lee, Joon Ho Shin | 2020-06-23 |
| 10630406 | Method for providing mobile coupon and mobile electronic device supporting the same | Ji-Hea Park, Se-Jun SONG | 2020-04-21 |
| 10354774 | Composition for forming conductive pattern and resin structure having conductive pattern | Han Nah Jeong, Cheol Hee Park, Chee Sung Park, Jae-Hyun Kim, Shin Hee Jun +2 more | 2019-07-16 |
| 10297363 | Composition for forming conductive pattern and resin structure having conductive pattern | Shin Hee Jun, Dae Ki Lee, Se-Hui Sohn, Han Nah Jeong, Cheol Hee Park +2 more | 2019-05-21 |
| 10183866 | Composition for forming conductive pattern and resin structure having conductive pattern | Han Nah Jeong, Chee Sung Park, Cheol Hee Park, Jae-Hyun Kim, Shin Hee Jun +2 more | 2019-01-22 |
| 10093455 | Tongs for sealing opening of bag | — | 2018-10-09 |
| 9998523 | Method for controlling file name and electronic device thereof | — | 2018-06-12 |
| 9872386 | Composition for forming conductive pattern, method for forming conductive pattern using same, and resin structure having conductive pattern | Chee Sung Park, Cheol Hee Park, Han Nah Jeong, Jae-Hyun Kim, Shin Hee Jun +2 more | 2018-01-16 |
| 8338921 | Wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield and a method for fabricating the same | Chang Jun Park, Kwon Whan Han, Seong Cheol Kim, Sung Min Kim, Hyeong-Seok Choi +2 more | 2012-12-25 |
| D659011 | Decorative package surface design | — | 2012-05-08 |
| 7898834 | Semiconductor chip with chip selection structure and stacked semiconductor package having the same | Sung Min Kim, Chang Jun Park, Kwon Whan Han, Seong Cheol Kim | 2011-03-01 |
| 7859102 | Multi-layer stacked wafer level semiconductor package module | Sung Min Kim, Chang Jun Park, Kwon Whan Han, Seong Cheol Kim, Hyeong-Seok Choi | 2010-12-28 |
| 7795073 | Method for manufacturing stack package using through-electrodes | Kwon Whan Han, Chang Jun Park, Seong Cheol Kim, Sung Min Kim, Hyeong-Seok Choi | 2010-09-14 |
| 7795139 | Method for manufacturing semiconductor package | Kwon Whan Han, Chang Jun Park, Min Suk Suh, Seong Cheol Kim, Sung Min Kim +3 more | 2010-09-14 |