Issued Patents All Time
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11245977 | Electric component with sensitive component structures and method for producing an electric component with sensitive component structures | Christian Bauer, Jürgen Portmann, Alois Stelzl, Wolfgang Pahl | 2022-02-08 |
| 10164166 | MEMS component and method for encapsulating MEMS components | Alois Stelzl, Christian Bauer, Jürgen Portmann, Wolfgang Pahl | 2018-12-25 |
| 9853204 | MEMS component and method for encapsulating MEMS components | Alois Stelzl, Christian Bauer, Jürgen Portmann, Wolfgang Pahl | 2017-12-26 |
| 9006868 | Encapsulation of an MEMS component and a method for producing said component | Christian Bauer, Jürgen Portmann, Alois Stelzl | 2015-04-14 |
| 8674498 | MEMS package and method for the production thereof | Gregor Feiertag, Alexander Schmajew | 2014-03-18 |
| 8294535 | Electrical component and production method | Gregor Feiertag, Wolfgang Pahl, Alois Stelzl | 2012-10-23 |
| 7608789 | Component arrangement provided with a carrier substrate | Alois Stelzl | 2009-10-27 |
| 7518201 | Method for encapsulating an electrical component, and surface acoustic wave device encapsulated using said method | Alois Stelzl, Gregor Feiertag | 2009-04-14 |
| 7094626 | Method for encapsulating an electrical component | Alois Stelzl, Gregor Feiertag | 2006-08-22 |
| 6909183 | Substrate for an electric component and method for the production thereof | Gregor Feiertag, Alois Stelzl | 2005-06-21 |
| 6838739 | Component with a label | Alois Stelzl, Ernst Christi | 2005-01-04 |
| 6685168 | Surface acoustic wave component | Alois Stelzl, Karl Weidner, Manfred Wossler | 2004-02-03 |
| 6555758 | Multiple blank for electronic components such as SAW components, and method of building up bumps, solder frames, spacers and the like | Alois Stelzl, Karl Weidner, Manfred Wossler | 2003-04-29 |
| 6528924 | Electronic component, in particular a component operating with surface acoustic waves | Alois Stelzl, Wolfgang Pahl | 2003-03-04 |
| 6519822 | Method for producing an electronic component | Alois Stelzl | 2003-02-18 |
| 6449828 | Method of producing a surface acoustic wave component | Wolfgang Pahl, Alois Stelzl | 2002-09-17 |
| 6310420 | Electronic component in particular an saw component operating with surface acoustic waves and a method for its production | Wolfgang Pahl, Alois Stelzl | 2001-10-30 |
| 6242842 | Electrical component, in particular saw component operating with surface acoustic waves, and a method for its production | Wolfgang Pahl, Alois Stelzl | 2001-06-05 |
| 6136175 | Method of producing an electronic component, in particular a surface acoustic wave component | Alois Stelzl, Wolfgang Pahl, Jurgen Machui | 2000-10-24 |
| 6057222 | Method for the production of flip-chip mounting-ready contacts of electrical components | Wolfgang Pahl, Alois Stelzl | 2000-05-02 |
| 5311010 | Buffer for a gamma-insensitive optical sensor with gas and a buffer assembly | — | 1994-05-10 |
| 5294789 | Gamma-insensitive optical sensor | — | 1994-03-15 |
| 4761787 | Transversely excited waveguide laser | Hinrich Heynisch, Klemens Hubner, Hubert Weber | 1988-08-02 |
| 4619500 | Method for producing orientation layers for liquid crystal displays and liquid crystal displays having orientation layers | Hellmut Ahne, Roland Rubner | 1986-10-28 |
| 4590103 | Method for the preparation of thin polyimide film | Hellmut Ahne, Wolfgang Kleeberg, Roland Rubner | 1986-05-20 |