| 11245977 |
Electric component with sensitive component structures and method for producing an electric component with sensitive component structures |
Christian Bauer, Hans Kruger, Alois Stelzl, Wolfgang Pahl |
2022-02-08 |
| 11239170 |
Stacked modules |
Andreas Franz, Claus Reitlinger, Stefan Kiefl, Oliver Freudenberg, Karl Weidner |
2022-02-01 |
| 10680159 |
MEMS component having a high integration density |
Thomas Metzger |
2020-06-09 |
| 10164166 |
MEMS component and method for encapsulating MEMS components |
Hans Kruger, Alois Stelzl, Christian Bauer, Wolfgang Pahl |
2018-12-25 |
| 10154582 |
Method for producing a cased electrical component |
Wolfgang Pahl |
2018-12-11 |
| 10136226 |
Top-port MEMS microphone and method of manufacturing the same |
Jan Tue Ravnkilde, Marcel Giesen, Kurt Rasmussen, Morten Ginnerup, Pirmin Hermann Otto Rombach +3 more |
2018-11-20 |
| 9853204 |
MEMS component and method for encapsulating MEMS components |
Hans Kruger, Alois Stelzl, Christian Bauer, Wolfgang Pahl |
2017-12-26 |
| 9844128 |
Cased electrical component |
Wolfgang Pahl |
2017-12-12 |
| 9278854 |
Method for producing a sensor |
Wolfgang Pahl, Anton Leidl, Robert Eichinger, Christian Siegel, Karl Nicolaus +2 more |
2016-03-08 |
| 9006868 |
Encapsulation of an MEMS component and a method for producing said component |
Christian Bauer, Hans Kruger, Alois Stelzl |
2015-04-14 |
| 7388281 |
Encapsulated electronic component and production method |
Hans Krueger, Karl Nicolaus, Gregor Feiertag, Alois Stelzl |
2008-06-17 |
| 6982380 |
Encapsulated component which is small in terms of height and method for producing the same |
Christian Hoffmann, Hans Krueger |
2006-01-03 |
