Issued Patents All Time
Showing 1–25 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11245977 | Electric component with sensitive component structures and method for producing an electric component with sensitive component structures | Christian Bauer, Hans Kruger, Jürgen Portmann, Wolfgang Pahl | 2022-02-08 |
| 10164166 | MEMS component and method for encapsulating MEMS components | Hans Kruger, Christian Bauer, Jürgen Portmann, Wolfgang Pahl | 2018-12-25 |
| 9853204 | MEMS component and method for encapsulating MEMS components | Hans Kruger, Christian Bauer, Jürgen Portmann, Wolfgang Pahl | 2017-12-26 |
| 9647196 | Wafer-level package and method for production thereof | Christian Bauer, Hans Krueger, Juergen Portmann, Wolfgang Pahl, Robert Koch | 2017-05-09 |
| 9382110 | Component and method for producing a component | Christian Bauer, Hans Krueger, Juergen Portmann | 2016-07-05 |
| 9165905 | Method for connecting a plurality of unpackaged substrates | Hans Krueger, Alexander Schmajew | 2015-10-20 |
| 9114979 | Method and apparatus for producing chip devices, and chip device produced by means of the method | Michael Gerner, Hans Krueger | 2015-08-25 |
| 9006868 | Encapsulation of an MEMS component and a method for producing said component | Christian Bauer, Hans Kruger, Jürgen Portmann | 2015-04-14 |
| 8865499 | MEMS microphone and method for producing the MEMS microphone | Wolfgang Pahl, Hans Krueger, Gregor Feiertag, Anton Leidl, Stefan Seitz | 2014-10-21 |
| 8759677 | Hermetically sealed housing for electronic components and manufacturing method | Christian Bauer, Hans Krueger, Juergen Portmann | 2014-06-24 |
| 8691369 | Element with optical marking, manufacturing method, and use | Alexander Schmajew, Hans Krueger | 2014-04-08 |
| 8580613 | Semiconductor chip arrangement with sensor chip and manufacturing method | Gregor Feiertag, Hans Krueger, Anton Leidl | 2013-11-12 |
| 8432007 | MEMS package and method for the production thereof | Anton Leidl, Hans Krueger, Wolfgang Pahl, Stefan Seitz | 2013-04-30 |
| 8404516 | Method for producing a MEMS package | Christian Bauer, Gregor Feiertag, Hans Krueger | 2013-03-26 |
| 8294535 | Electrical component and production method | Gregor Feiertag, Hans Kruger, Wolfgang Pahl | 2012-10-23 |
| 8169041 | MEMS package and method for the production thereof | Wolfgang Pahl, Anton Leidl, Stefan Seitz, Hans Krueger | 2012-05-01 |
| 8110962 | MEMS component and method for production | Christian Bauer, Hans Krueger, Werner Ruile | 2012-02-07 |
| 7673386 | Flip-chip component production method | Christian Bauer, Hans Krueger, Robert Hammedinger | 2010-03-09 |
| 7608789 | Component arrangement provided with a carrier substrate | Hans Kruger | 2009-10-27 |
| 7552532 | Method for hermetically encapsulating a component | Hans Krueger, Gregor Feiertag, Ernst Christl | 2009-06-30 |
| 7544540 | Encapsulated electrical component and production method | Christian Bauer, Hans Krueger | 2009-06-09 |
| 7518201 | Method for encapsulating an electrical component, and surface acoustic wave device encapsulated using said method | Hans Kruger, Gregor Feiertag | 2009-04-14 |
| 7388281 | Encapsulated electronic component and production method | Hans Krueger, Jürgen Portmann, Karl Nicolaus, Gregor Feiertag | 2008-06-17 |
| 7259041 | Method for the hermetic encapsulation of a component | Hans Krueger, Ernst Christl | 2007-08-21 |
| 7094626 | Method for encapsulating an electrical component | Hans Kruger, Gregor Feiertag | 2006-08-22 |