Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11605571 | Package comprising a substrate, an integrated device, and an encapsulation layer with undercut | Alberto Jose Teixeira De Queiros, Andreas Franz, Anna Katharina KREFFT | 2023-03-14 |
| 11239170 | Stacked modules | Andreas Franz, Jürgen Portmann, Stefan Kiefl, Oliver Freudenberg, Karl Weidner | 2022-02-01 |
| 10438901 | Integrated circuit package comprising an enhanced electromagnetic shield | Anna Katharina KREFFT | 2019-10-08 |
| 9576870 | Module package and production method | Frank Rehme, Rudolf Bart | 2017-02-21 |
| 9386734 | Method for producing a plurality of electronic devices | Gerhard Zeller | 2016-07-05 |