Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11605571 | Package comprising a substrate, an integrated device, and an encapsulation layer with undercut | Alberto Jose Teixeira De Queiros, Andreas Franz, Claus Reitlinger | 2023-03-14 |
| 10438901 | Integrated circuit package comprising an enhanced electromagnetic shield | Claus Reitlinger | 2019-10-08 |