MW

Manfred Wossler

EA Epcos Ag: 2 patents #202 of 606Top 35%
SA Siemens Aktiengesellschaft: 2 patents #6,658 of 22,248Top 30%
Infineon Technologies Ag: 1 patents #4,439 of 7,486Top 60%
Overall (All Time): #1,038,375 of 4,157,543Top 25%
5
Patents All Time

Issued Patents All Time

Showing 1–5 of 5 patents

Patent #TitleCo-InventorsDate
6969917 Electronic chip component with an integrated circuit and fabrication method Hans-Jurgen Hacke 2005-11-29
6685168 Surface acoustic wave component Alois Stelzl, Hans Kruger, Karl Weidner 2004-02-03
6555758 Multiple blank for electronic components such as SAW components, and method of building up bumps, solder frames, spacers and the like Alois Stelzl, Hans Kruger, Karl Weidner 2003-04-29
6504104 Flexible wiring for the transformation of a substrate with edge contacts into a ball grid array Hans-Juergen Hacke, Karl Weidner, Wolfgang Radlik 2003-01-07
6256877 Method for transforming a substrate with edge contacts into a ball grid array Hans-Juergen Hacke, Karl Weidner, Wolfgang Radlik 2001-07-10