Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6504104 | Flexible wiring for the transformation of a substrate with edge contacts into a ball grid array | Manfred Wossler, Karl Weidner, Wolfgang Radlik | 2003-01-07 |
| 6256877 | Method for transforming a substrate with edge contacts into a ball grid array | Manfred Wossler, Karl Weidner, Wolfgang Radlik | 2001-07-10 |
| 6157541 | Stack arrangement for two semiconductor memory chips and printed board for accepting a plurality of such stack arrangements | — | 2000-12-05 |
| 4795694 | Manufacture of fine structures for semiconductor contacting | Alfred Groeber, Hans Hadersbeck, Fritz Mueller, Hubert Zukier | 1989-01-03 |
| 4268349 | Process for the production of printed circuits with solder rejecting sub-zones | Hans Hadersbeck | 1981-05-19 |
| 4210926 | Intermediate member for mounting and contacting a semiconductor body | — | 1980-07-01 |