Issued Patents All Time
Showing 1–25 of 75 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9647196 | Wafer-level package and method for production thereof | Christian Bauer, Juergen Portmann, Alois Stelzl, Wolfgang Pahl, Robert Koch | 2017-05-09 |
| 9585734 | Low profile self-ligating orthodontic appliance with clip | Ming-Lai Lai, Calvin N. Corpus, Ruedger Rubbert | 2017-03-07 |
| 9382110 | Component and method for producing a component | Christian Bauer, Juergen Portmann, Alois Stelzl | 2016-07-05 |
| 9165905 | Method for connecting a plurality of unpackaged substrates | Alexander Schmajew, Alois Stelzl | 2015-10-20 |
| 9114979 | Method and apparatus for producing chip devices, and chip device produced by means of the method | Michael Gerner, Alois Stelzl | 2015-08-25 |
| 9056760 | Miniaturized electrical component comprising an MEMS and an ASIC and production method | Gregor Feiertag, Wolfgang Pahl, Anton Leidl | 2015-06-16 |
| 9035189 | Circuit board with flexible region and method for production thereof | Wolfgang Pahl, Peter Demmer | 2015-05-19 |
| 8865499 | MEMS microphone and method for producing the MEMS microphone | Wolfgang Pahl, Gregor Feiertag, Alois Stelzl, Anton Leidl, Stefan Seitz | 2014-10-21 |
| 8759677 | Hermetically sealed housing for electronic components and manufacturing method | Christian Bauer, Juergen Portmann, Alois Stelzl | 2014-06-24 |
| 8691369 | Element with optical marking, manufacturing method, and use | Alexander Schmajew, Alois Stelzl | 2014-04-08 |
| 8580613 | Semiconductor chip arrangement with sensor chip and manufacturing method | Gregor Feiertag, Anton Leidl, Alois Stelzl | 2013-11-12 |
| 8432007 | MEMS package and method for the production thereof | Anton Leidl, Alois Stelzl, Wolfgang Pahl, Stefan Seitz | 2013-04-30 |
| 8404516 | Method for producing a MEMS package | Christian Bauer, Gregor Feiertag, Alois Stelzl | 2013-03-26 |
| 8169041 | MEMS package and method for the production thereof | Wolfgang Pahl, Anton Leidl, Stefan Seitz, Alois Stelzl | 2012-05-01 |
| 8110962 | MEMS component and method for production | Christian Bauer, Werner Ruile, Alois Stelzl | 2012-02-07 |
| 8098001 | Component with reduced temperature response, and method for production | Wolfgang Pahl, Werner Ruile | 2012-01-17 |
| 7751925 | System to manufacture custom orthodontic appliances, program product, and related methods | Ruedger Rubbert | 2010-07-06 |
| 7673386 | Flip-chip component production method | Alois Stelzl, Christian Bauer, Robert Hammedinger | 2010-03-09 |
| 7552532 | Method for hermetically encapsulating a component | Alois Stelzl, Gregor Feiertag, Ernst Christl | 2009-06-30 |
| 7544540 | Encapsulated electrical component and production method | Christian Bauer, Alois Stelzl | 2009-06-09 |
| 7518249 | Electric component with a flip-chip construction | Karl Nicolaus, Juergen Portmann, Peter Selmeier | 2009-04-14 |
| 7388281 | Encapsulated electronic component and production method | Jürgen Portmann, Karl Nicolaus, Gregor Feiertag, Alois Stelzl | 2008-06-17 |
| 7259041 | Method for the hermetic encapsulation of a component | Alois Stelzl, Ernst Christl | 2007-08-21 |
| 6982380 | Encapsulated component which is small in terms of height and method for producing the same | Christian Hoffmann, Jürgen Portmann | 2006-01-03 |
| 6722030 | Process for manufacturing an electronic component, in particular a surface-wave component working with acoustic surface waves | Alois Stelzl, Peter Demmer | 2004-04-20 |