Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11516925 | Package stack structure and method for manufacturing the same | Yuan-Hung Hsu, Chang-Fu Lin, Rung-Jeng Lin, Fu-Tang Huang | 2022-11-29 |
| 11380978 | Electronic package and method for fabricating the same | Shi-Min Zhou, Rung-Jeng Lin, Kuo-Hua Yu, Chang-Fu Lin | 2022-07-05 |
| 11289794 | Electronic package | Rung-Jeng Lin, Shi-Min Zhou, Kuo-Hua Yu, Chang-Fu Lin | 2022-03-29 |
| 11101566 | Method for fabricating electronic package | Chun-Yi Huang, Chang-Fu Lin, Rung-Jeng Lin, Kuo-Hua Yu | 2021-08-24 |
| 10756438 | Electronic package and method for fabricating the same | Chun-Yi Huang, Chang-Fu Lin, Rung-Jeng Lin, Kuo-Hua Yu | 2020-08-25 |
| 10361150 | Substrate construction and electronic package including the same | Chee-Key Chung, Yu-Min Lo, Chang-Fu Lin, Fu-Tang Huang | 2019-07-23 |