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Multi-layered chemical-mechanical planarization pad |
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Chemical-mechanical planarization pad including patterned structural domains |
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Multi-layered chemical-mechanical planarization pad |
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Method of grooving a chemical-mechanical planarization pad |
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Chemical mechanical planarization pad with void network |
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| 8435099 |
Chemical-mechanical planarization pad including patterned structural domains |
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Polishing pad with controlled void formation |
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Smooth pads for CMP and polishing substrates |
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2006-10-10 |
| 6001269 |
Method for polishing a composite comprising an insulator, a metal, and titanium |
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| 5770103 |
Composition and method for polishing a composite comprising titanium |
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1998-06-23 |