Issued Patents All Time
Showing 1–25 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10943907 | Integrated circuitry comprising an array, method of forming an array, method of forming DRAM circuitry, and method used in the fabrication of integrated circuitry | Cornel Bozdog, Abhilasha Bhardwaj, Byeung Chul Kim, Michael E. Koltonski, Matthew Thorum | 2021-03-09 |
| 10707211 | Integrated circuitry comprising an array, method of forming an array, method of forming DRAM circuitry, and method used in the fabrication of integrated circuitry | Cornel Bozdog, Abhilasha Bhardwaj, Byeung Chul Kim, Michael E. Koltonski, Matthew Thorum | 2020-07-07 |
| 7939394 | Multiple-depth STI trenches in integrated circuit fabrication | Shubneesh Batra, Howard C. Kirsch, Xianfeng Zhou, Chih-Chen Cho | 2011-05-10 |
| 7387940 | Methods of forming trench isolation in the fabrication of integrated circuitry, methods of fabricating memory circuitry, integrated circuitry and memory integrated circuitry | Robert D. Patraw, M. Ceredig Roberts, Keith R. Cook | 2008-06-17 |
| 7354812 | Multiple-depth STI trenches in integrated circuit fabrication | Shubneesh Batra, Howard C. Kirsch, Xianfeng Zhou, Chih-Chen Cho | 2008-04-08 |
| 7276442 | Method for forming a metallization layer | Chris C. Yu | 2007-10-02 |
| 7116118 | Method and apparatus for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability | Warren M. Farnworth, Malcolm Grief | 2006-10-03 |
| 7098475 | Apparatuses configured to engage a conductive pad | Warren M. Farnworth, Malcolm Grief | 2006-08-29 |
| 7026835 | Engagement probe having a grouping of projecting apexes for engaging a conductive pad | Warren M. Farnworth, Malcolm Grief | 2006-04-11 |
| 6833727 | Method and apparatus for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability | Warren M. Farnworth, Malcolm Grief | 2004-12-21 |
| 6700211 | Method for forming conductors in semiconductor devices | Fernando Gonzalez, Mike Violette | 2004-03-02 |
| 6686758 | Engagement probe and apparatuses configured to engage a conductive pad | Warren M. Farnworth, Malcolm Grief | 2004-02-03 |
| 6670819 | Methods of engaging electrically conductive pads on a semiconductor substrate | Warren M. Farnworth, Malcolm Grief | 2003-12-30 |
| 6670713 | Method for forming conductors in semiconductor devices | Fernando Gonzalez, Mike Violette | 2003-12-30 |
| 6657450 | Methods of engaging electrically conductive test pads on a semiconductor substrate removable electrical interconnect apparatuses, engagement probes and removable engagement probes | Warren M. Farnworth, Malcolm Grief | 2003-12-02 |
| 6653733 | Conductors in semiconductor devices | Fernando Gonzalez, Mike Violette | 2003-11-25 |
| 6614249 | Methods of forming apparatuses and a method of engaging electrically conductive test pads on a semiconductor substrate | Warren M. Farnworth, Malcolm Grief | 2003-09-02 |
| 6573740 | Method of forming an apparatus configured to engage an electrically conductive pad on a semiconductive substrate and a method of engaging electrically conductive pads on a semiconductive substrate | Warren M. Farnworth, Malcolm Grief | 2003-06-03 |
| 6563220 | Method for forming conductors in semiconductor devices | Fernando Gonzalez, Mike Violette | 2003-05-13 |
| 6541809 | Method of making straight wall containers and the resultant containers | Ceredig Roberts | 2003-04-01 |
| 6462571 | Engagement probes | Warren M. Farnworth, Malcolm Grief | 2002-10-08 |
| 6392426 | Methods of forming apparatuses and a method of engaging electrically conductive test pads on a semiconductor substrate | Warren M. Farnworth, Malcolm Grief | 2002-05-21 |
| 6380754 | Removable electrical interconnect apparatuses including an engagement proble | Warren M. Farnworth, Malcolm Grief | 2002-04-30 |
| 6376284 | Method of fabricating a memory device | Fernando Gonzalez, Mike Violette | 2002-04-23 |
| 6369431 | Method for forming conductors in semiconductor devices | Fernando Gonzalez, Mike Violette | 2002-04-09 |