Issued Patents All Time
Showing 26–40 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6235639 | Method of making straight wall containers and the resultant containers | Ceredig Roberts | 2001-05-22 |
| 6171952 | Methods of forming metallization layers and integrated circuits containing such | Chris C. Yu | 2001-01-09 |
| 6127195 | Methods of forming an apparatus for engaging electrically conductive pads and method of forming a removable electrical interconnect apparatus | Warren M. Farnworth, Malcolm Grief | 2000-10-03 |
| 6124721 | Method of engaging electrically conductive test pads on a semiconductor substrate | Warren M. Farnworth, Malcolm Grief | 2000-09-26 |
| 5838445 | Method and apparatus for determining surface roughness | Guy F. Hudson | 1998-11-17 |
| 5662788 | Method for forming a metallization layer | Chris C. Yu | 1997-09-02 |
| 5523697 | Testing apparatus for engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereof | Warren M. Farnworth, Malcolm Grief | 1996-06-04 |
| 5326428 | Method for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability | Warren M. Farnworth, Malcolm Grief | 1994-07-05 |
| 5314843 | Integrated circuit polishing method | Chris C. Yu, Trung T. Doan | 1994-05-24 |
| 5236865 | Method for simultaneously forming silicide and effecting dopant activation on a semiconductor wafer | Trung T. Doan, Chang Yu | 1993-08-17 |
| 5147819 | Semiconductor metallization method | Chang Yu, Trung T. Doan | 1992-09-15 |
| 5139967 | Process for planarizing insulating dielectric material | Trung T. Doan, Chang Yu | 1992-08-18 |
| 5124780 | Conductive contact plug and a method of forming a conductive contact plug in an integrated circuit using laser planarization | Chang Yu, Trung T. Doan, Mark E. Tuttle | 1992-06-23 |
| 5094977 | Stress reduction in metal films by laser annealing | Chang Yu, Trung T. Doan | 1992-03-10 |
| 5032233 | Method for improving step coverage of a metallization layer on an integrated circuit by use of a high melting point metal as an anti-reflective coating during laser planarization | Chang Yu, Trung T. Doan | 1991-07-16 |