Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10916484 | Electronic device including redistribution layer pad having a void | Robert Fehler, Francesca Arcioni, Christian Geissler, Walter Hartner, Thorsten Meyer +2 more | 2021-02-09 |
| 10607911 | Chip carrier laminate with high frequency dielectric and thermomechanical buffer | Martin Richard Niessner, Walter Hartner, Sebastian Pahlke | 2020-03-31 |