Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6708873 | Apparatus and method for filling high aspect ratio via holes in electronic substrates | Peter A. Gruber, Lubomyr T. Romankiw | 2004-03-23 |
| 6581280 | Method for filling high aspect ratio via holes in electronic substrates | Brian E. Curcio, Peter A. Gruber, Konstantinos I. Papathomas, Mark D. Poliks | 2003-06-24 |
| 6579149 | Support and alignment device for enabling chemical mechanical polishing rinse and film measurements | Richard J. Lebel, Rock Nadeau, Paul Smith, Hemantha K. Wickramasinghe, Theodore G. van Kessel | 2003-06-17 |
| 6527158 | Method and apparatus for forming solder bumps | Guy Paul Brouillette, Peter A. Gruber | 2003-03-04 |
| 6461136 | Apparatus for filling high aspect ratio via holes in electronic substrates | Peter A. Gruber, Lubomyr T. Romankiw | 2002-10-08 |
| 6452117 | Method for filling high aspect ratio via holes in electronic substrates and the resulting holes | Brian E. Curcio, Peter A. Gruber, Konstantinos I. Papathomas, Mark D. Poliks | 2002-09-17 |
| 6394334 | Method and apparatus for forming solder bumps | Guy Paul Brouillette, Peter A. Gruber | 2002-05-28 |
| 6362557 | Ultrasonic method and actuator for inducing motion of an object | Peter A. Gruber, George F. Walker | 2002-03-26 |
| 6319093 | Chemical-mechanical polishing system and method for integrated spin dry-film thickness measurement | Richard J. Lebel, Rock Nadeau, Paul Smith, Hemantha K. Wickramasinghe, Theodore G. van Kessel | 2001-11-20 |
| 6056191 | Method and apparatus for forming solder bumps | Guy Paul Brouillette, Peter A. Gruber | 2000-05-02 |