| 8093730 |
Underfilled semiconductor die assemblies and methods of forming the same |
Cary J. Baerlocher |
2012-01-10 |
| 7993977 |
Method of forming molded standoff structures on integrated circuit devices |
James L. Voelz |
2011-08-09 |
| 7851907 |
Semiconductor integrated circuit package having electrically disconnected solder balls for mounting |
Cary J. Baerlocher |
2010-12-14 |
| 7642643 |
Apparatus for molding a semiconductor die package with enhanced thermal conductivity |
Todd O. Bolken |
2010-01-05 |
| 7498606 |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
Bret K. Street, James M. Derderian |
2009-03-03 |
| 7485971 |
Electronic device package |
Jason L. Fuller, Tongbi Jiang |
2009-02-03 |
| 7468559 |
Semiconductor integrated circuit package having electrically disconnected solder balls for mounting |
Cary J. Baerlocher |
2008-12-23 |
| 7416913 |
Methods of manufacturing microelectronic imaging units with discrete standoffs |
William Reeder, Bret K. Street, James M. Derderian |
2008-08-26 |
| 7417294 |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
William Reeder, Bret K. Street, James M. Derderian |
2008-08-26 |
| 7364934 |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
Bret K. Street, James M. Derderian |
2008-04-29 |
| 7342319 |
Semiconductor integrated circuit package having electrically disconnected solder balls for mounting |
Cary J. Baerlocher |
2008-03-11 |
| 7276802 |
Semiconductor integrated circuit package having electrically disconnected solder balls for mounting |
Cary J. Baerlocher |
2007-10-02 |
| 7268067 |
Semiconductor integrated circuit package having electrically disconnected solder balls for mounting |
Cary J. Baerlocher |
2007-09-11 |
| 7262074 |
Methods of fabricating underfilled, encapsulated semiconductor die assemblies |
Cary J. Baerlocher |
2007-08-28 |
| 7116000 |
Underfilled, encapsulated semiconductor die assemblies and methods of fabrication |
Cary J. Baerlocher |
2006-10-03 |
| 7084515 |
Electronic device package |
Jason L. Fuller, Tongbi Jiang |
2006-08-01 |
| 6987058 |
Methods for underfilling and encapsulating semiconductor device assemblies with a single dielectric material |
— |
2006-01-17 |
| 6969914 |
Electronic device package |
Jason L. Fuller, Tongbi Jiang |
2005-11-29 |
| 6835592 |
Methods for molding a semiconductor die package with enhanced thermal conductivity |
Todd O. Bolken |
2004-12-28 |
| 5072795 |
Pressure compensator for drill bit lubrication system |
Steve R. Delgado, Robert J. Kotch |
1991-12-17 |
