Issued Patents All Time
Showing 1–25 of 118 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431359 | Semiconductor package electrical contacts and related methods | Yusheng LIN, Michael J. Seddon, Takashi Noma, Eiji KUROSE | 2025-09-30 |
| 12374555 | Die sidewall coatings and related methods | Yusheng LIN, Michael J. Seddon, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE | 2025-07-29 |
| 12374554 | Semiconductor packages with die including cavities and related methods | Michael J. Seddon, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE | 2025-07-29 |
| 12272572 | Non-planar semiconductor packaging systems and related methods | Michael J. Seddon | 2025-04-08 |
| 12255167 | Semiconductor packages with an intermetallic layer | Michael J. Seddon | 2025-03-18 |
| 12230559 | Semiconductor device and method of forming micro interconnect structures | Jefferson W. Hall, Michael J. Seddon | 2025-02-18 |
| 12230502 | Semiconductor package stress balance structures and related methods | Yusheng LIN, Michael J. Seddon, Takashi Noma, Eiji KUROSE | 2025-02-18 |
| 12199041 | Thinned semiconductor package and related methods | Yusheng LIN, Takashi Noma | 2025-01-14 |
| 12170239 | Direct bonded copper substrates fabricated using silver sintering | Erik Nino Tolentino, Shutesh Krishnan | 2024-12-17 |
| 12132008 | Multidie supports and related methods | Michael J. Seddon | 2024-10-29 |
| 12132005 | Supports for thinned semiconductor substrates and related methods | Michael J. Seddon | 2024-10-29 |
| 12119294 | Through-substrate via structure and method of manufacture | Michael J. Seddon | 2024-10-15 |
| 12040192 | Die sidewall coatings and related methods | Yusheng LIN, Michael J. Seddon, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE | 2024-07-16 |
| 12020972 | Curved semiconductor die systems and related methods | Michael J. Seddon | 2024-06-25 |
| 11908699 | Semiconductor packages with die including cavities | Michael J. Seddon, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE | 2024-02-20 |
| 11901184 | Backmetal removal methods | Michael J. Seddon, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE | 2024-02-13 |
| 11894234 | Semiconductor packages with die support structure for thin die | Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE | 2024-02-06 |
| 11894245 | Non-planar semiconductor packaging systems and related methods | Michael J. Seddon | 2024-02-06 |
| 11854995 | Supports for thinned semiconductor substrates and related methods | Michael J. Seddon | 2023-12-26 |
| 11830756 | Temporary die support structures and related methods | Michael J. Seddon | 2023-11-28 |
| 11776870 | Direct bonded copper substrates fabricated using silver sintering | Erik Nino Tolentino, Shutesh Krishnan | 2023-10-03 |
| 11710691 | Semiconductor device and method of forming micro interconnect structures | Jefferson W. Hall, Michael J. Seddon | 2023-07-25 |
| 11646267 | Thinned semiconductor package and related methods | Yusheng LIN, Takashi Noma | 2023-05-09 |
| 11616008 | Through-substrate via structure and method of manufacture | Michael J. Seddon | 2023-03-28 |
| 11569140 | Semiconductor package with elastic coupler and related methods | Yusheng LIN, Chee Hiong CHEW | 2023-01-31 |