Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8284395 | Wafer surface measuring apparatus | Eiji Kamiyama | 2012-10-09 |
| 8110486 | Method of manufacturing semiconductor wafer by forming a strain relaxation SiGe layer on an insulating layer of SOI wafer | Koji Matsumoto, Tomoyuki Hora, Akihiko Endo, Masaharu Ninomiya | 2012-02-07 |
| 8048769 | Method for producing bonded wafer | Nobuyuki Morimoto, Akihiko Endo | 2011-11-01 |
| 7960225 | Method of controlling film thinning of semiconductor wafer for solid-state image sensing device | Akihiko Endo, Yoshihisa Nonogaki, Hideki Nishihata | 2011-06-14 |
| 7951716 | Wafer and method of producing the same | Kazuo Hujie, Isoroku Ono | 2011-05-31 |
| 7855129 | Method for manufacturing direct bonded SOI wafer and direct bonded SOI wafer manufactured by the method | Shinji Okawa, Isoroku Ono | 2010-12-21 |
| 7829436 | Process for regeneration of a layer transferred wafer and regenerated layer transferred wafer | Shinji Okawa, Isoroku Ono | 2010-11-09 |
| 7781309 | Method for manufacturing direct bonded SOI wafer and direct bonded SOI wafer manufactured by the method | Shinji Okawa, Isoroku Ono | 2010-08-24 |
| 7736998 | Silicon-on insulator substrate and method for manufacturing the same | Ritarou Sano, Akihiko Endo | 2010-06-15 |
| 7718507 | Bonded wafer and method of producing the same | Kazuo Hujie, Isoroku Ono | 2010-05-18 |
| 7416960 | Method for manufacturing SOI substrate | Akihiko Endo, Tatsumi Kusaba, Hidehiko Okuda | 2008-08-26 |
| 7364984 | Method for manufacturing SOI substrate | Akihiko Endo, Tatsumi Kusaba, Hidehiko Okuda | 2008-04-29 |
| 7354844 | Method for manufacturing SOI substrate | Akihiko Endo, Tatsumi Kusaba, Hidehiko Okuda | 2008-04-08 |