Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12255076 | Method for manufacturing leadless semiconductor package with wettable flanks | Ian Harvey Arellano, Aaron Cadag | 2025-03-18 |
| 12211774 | Lead stabilization in semiconductor packages | Frederick Ray Gomez, Aaron Cadag | 2025-01-28 |
| 11929259 | Method for manufacturing leadless semiconductor package with wettable flanks | Ian Harvey Arellano, Aaron Cadag | 2024-03-12 |
| 11916090 | Tapeless leadframe package with exposed integrated circuit die | Aaron Cadag, Rohn Kenneth Serapio | 2024-02-27 |
| 11557548 | Package with interlocking leads and manufacturing the same | Aaron Cadag, Lester Joseph Belalo | 2023-01-17 |
| 11552007 | Modified leadframe design with adhesive overflow recesses | Rennier Rodriguez, Aiza Marie Agudon, Jefferson Talledo, Moonlord Manalo, Rammil Seguido | 2023-01-10 |
| 11069601 | Leadless semiconductor package with wettable flanks | Ian Harvey Arellano, Aaron Cadag | 2021-07-20 |
| 10957634 | Modified leadframe design with adhesive overflow recesses | Rennier Rodriguez, Aiza Marie Agudon, Jefferson Talledo, Moonlord Manalo, Rammil Seguido | 2021-03-23 |
| 10910295 | QFN pre-molded leadframe having a solder wettable sidewall on each lead | Aaron Cadag, Ernesto Antilano, Jr. | 2021-02-02 |
| 10903172 | Package with interlocking leads and manufacturing the same | Aaron Cadag, Lester Joseph Belalo | 2021-01-26 |
| 10615104 | Modified leadframe design with adhesive overflow recesses | Rennier Rodriguez, Aiza Marie Agudon, Jefferson Talledo, Moonlord Manalo, Rammil Seguido | 2020-04-07 |
| 10541196 | QFN pre-molded leadframe having a solder wettable sidewall on each lead | Aaron Cadag, Ernesto Antilano, Jr. | 2020-01-21 |
| 10529672 | Package with interlocking leads and manufacturing the same | Aaron Cadag, Lester Joseph Belalo | 2020-01-07 |
| 10461019 | Package with backside protective layer during molding to prevent mold flashing failure | Aaron Cadag, Ian Harvey Arellano | 2019-10-29 |
| 10128169 | Package with backside protective layer during molding to prevent mold flashing failure | Aaron Cadag, Ian Harvey Arellano | 2018-11-13 |
| 10109563 | Modified leadframe design with adhesive overflow recesses | Rennier Rodriguez, Aiza Marie Agudon, Jefferson Talledo, Moonlord Manalo, Rammil Seguido | 2018-10-23 |
| 10079198 | QFN pre-molded leadframe having a solder wettable sidewall on each lead | Aaron Cadag, Ernesto Antilano, Jr. | 2018-09-18 |
| 9953933 | Flow over wire die attach film and conductive molding compound to provide an electromagnetic interference shield for a semiconductor die | Aaron Cadag, Rennier Rodriguez | 2018-04-24 |
| 9842794 | Semiconductor package with integrated heatsink | Jefferson Talledo | 2017-12-12 |
| 9818675 | Semiconductor device including conductive clip with flexible leads and related methods | Jefferson Talledo | 2017-11-14 |
| 9324643 | Integrated circuit device having exposed contact pads and leads supporting the integrated circuit die and method of forming the device | Ricky Calustre | 2016-04-26 |
| 9165867 | Semiconductor device with lead frame contact solder balls and related methods | Jefferson Talledo | 2015-10-20 |