Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431359 | Semiconductor package electrical contacts and related methods | Yusheng LIN, Michael J. Seddon, Francis J. Carney, Takashi Noma | 2025-09-30 |
| 12374554 | Semiconductor packages with die including cavities and related methods | Michael J. Seddon, Francis J. Carney, Chee Hiong CHEW, Soon Wei WANG | 2025-07-29 |
| 12374555 | Die sidewall coatings and related methods | Francis J. Carney, Yusheng LIN, Michael J. Seddon, Chee Hiong CHEW, Soon Wei WANG | 2025-07-29 |
| 12341014 | Multi-faced molded semiconductor package and related methods | — | 2025-06-24 |
| 12230502 | Semiconductor package stress balance structures and related methods | Yusheng LIN, Michael J. Seddon, Francis J. Carney, Takashi Noma | 2025-02-18 |
| 12040192 | Die sidewall coatings and related methods | Francis J. Carney, Yusheng LIN, Michael J. Seddon, Chee Hiong CHEW, Soon Wei WANG | 2024-07-16 |
| 12040310 | Methods of forming semiconductor packages with back side metal | — | 2024-07-16 |
| 11908699 | Semiconductor packages with die including cavities | Michael J. Seddon, Francis J. Carney, Chee Hiong CHEW, Soon Wei WANG | 2024-02-20 |
| 11901184 | Backmetal removal methods | Michael J. Seddon, Francis J. Carney, Chee Hiong CHEW, Soon Wei WANG | 2024-02-13 |
| 11894234 | Semiconductor packages with die support structure for thin die | Francis J. Carney, Chee Hiong CHEW, Soon Wei WANG | 2024-02-06 |
| 11791297 | Molded semiconductor package and related methods | Sw Wang, CH CHEW, How Kiat Liew | 2023-10-17 |
| 11562981 | Methods of forming semiconductor packages with back side metal | — | 2023-01-24 |
| 11404276 | Semiconductor packages with thin die and related methods | Francis J. Carney, Chee Hiong CHEW, Soon Wei WANG | 2022-08-02 |
| 11404277 | Die sidewall coatings and related methods | Francis J. Carney, Yusheng LIN, Michael J. Seddon, Chee Hiong CHEW, Soon Wei WANG | 2022-08-02 |
| 11393692 | Semiconductor package electrical contact structures and related methods | Francis J. Carney, Michael J. Seddon, Yusheng LIN, Takashi Noma | 2022-07-19 |
| 11367619 | Semiconductor package electrical contacts and related methods | Yusheng LIN, Michael J. Seddon, Francis J. Carney, Takashi Noma | 2022-06-21 |
| 11361970 | Silicon-on-insulator die support structures and related methods | Michael J. Seddon, Francis J. Carney, Chee Hiong CHEW, Soon Wei WANG | 2022-06-14 |
| 11348796 | Backmetal removal methods | Michael J. Seddon, Francis J. Carney, Chee Hiong CHEW, Soon Wei WANG | 2022-05-31 |
| 11342189 | Semiconductor packages with die including cavities and related methods | Michael J. Seddon, Francis J. Carney, Chee Hiong CHEW, Soon Wei WANG | 2022-05-24 |
| 11328930 | Multi-faced molded semiconductor package and related methods | — | 2022-05-10 |
| 11244918 | Molded semiconductor package and related methods | Sw Wang, CH CHEW, How Kiat Liew | 2022-02-08 |
| 11018030 | Fan-out wafer level chip-scale packages and methods of manufacture | — | 2021-05-25 |
| 10943886 | Methods of forming semiconductor packages with back side metal | — | 2021-03-09 |
| 10529576 | Multi-faced molded semiconductor package and related methods | — | 2020-01-07 |
| 8809076 | Semiconductor device and method of automatically inspecting an appearance of the same | Hideaki Yoshimi, Shinzo Ishibe | 2014-08-19 |