| 7213331 |
Method for forming stencil |
Tongbi Jiang |
2007-05-08 |
| 7071030 |
Method of making a flexible substrate with a filler material |
Tongbi Jiang |
2006-07-04 |
| 6825569 |
BGA package having substrate with patterned solder mask defining open die attach area |
Tongbi Jiang |
2004-11-30 |
| 6770164 |
Method for attaching a semiconductor die to a substrate |
Tongbi Jiang |
2004-08-03 |
| 6770981 |
Composite interposer for BGA packages |
Tongbi Jiang |
2004-08-03 |
| 6710456 |
Composite interposer for BGA packages |
Tongbi Jiang |
2004-03-23 |
| 6709896 |
Methods for use in packaging applications using an adhesive composition |
Chad A. Cobbley, Tongbi Jiang |
2004-03-23 |
| 6707152 |
Semiconductor device, electrical conductor system, and method of making |
— |
2004-03-16 |
| 6699928 |
Adhesive composition for use in packaging applications |
Chad A. Cobbley, Tongbi Jiang |
2004-03-02 |
| 6662440 |
Z-axis electrical contact for microelectric devices |
Tongbi Jiang |
2003-12-16 |
| 6646354 |
Adhesive composition and methods for use in packaging applications |
Chad A. Cobbley, Tongbi Jiang |
2003-11-11 |
| 6616864 |
Z-axis electrical contact for microelectronic devices |
Tongbi Jiang |
2003-09-09 |
| 6541872 |
Multi-layered adhesive for attaching a semiconductor die to a substrate |
Tongbi Jiang |
2003-04-01 |
| 6521980 |
Controlling packaging encapsulant leakage |
Patrick W. Tandy, Joseph Brand, Brad D. Rumsey, Steven R. Stephenson, David J. Corisis +2 more |
2003-02-18 |
| 6395579 |
Controlling packaging encapsulant leakage |
Patrick W. Tandy, Joseph Brand, Brad D. Rumsey, Steven R. Stephenson, David J. Corisis +2 more |
2002-05-28 |
| 6352925 |
Method of making electrical conductor system for semiconductor device |
— |
2002-03-05 |
| 6210992 |
Controlling packaging encapsulant leakage |
Patrick W. Tandy, Joseph Brand, Brad D. Rumsey, Steven R. Stephenson, David J. Corisis +2 more |
2001-04-03 |
| 6118080 |
Z-axis electrical contact for microelectronic devices |
Tongbi Jiang |
2000-09-12 |
| 6048755 |
Method for fabricating BGA package using substrate with patterned solder mask open in die attach area |
Tongbi Jiang |
2000-04-11 |
| 5962862 |
Method and apparatus for verifying the presence or absence of a component |
Sven Evers, Kevin Gibbons |
1999-10-05 |
