Sven Evers — 25 Patents at Micron

Sven Evers has been granted 25 US patents while listed as an inventor at Micron. The first was granted in 1998 and the most recent in July 2005. Sven Evers ranks #158,593 of 4,157,543 US inventors in our database (top 3.8%). Patent records list Sven Evers in Boise, ID, US.

Issued Patents All Time

Showing 1–25 of 25 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
6921017	Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits	Craig T. Clyne	2005-07-26	$1,779,000
6817823	Method, device and system for semiconductor wafer transfer	Edward R. Fix, William Becia, Douglas R. Farnlund	2004-11-16	$9,209,000
6709967	Laser wire bonding for wire embedded dielectrics to integrated circuits	—	2004-03-23	$2,248,000
6634538	Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits	Craig T. Clyne	2003-10-21	$3,052,000
6588649	Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits	Craig T. Clyne	2003-07-08	$3,587,000
6390853	Laser wire bonding for wire embedded dielectrics to integrated circuits	—	2002-05-21	$4,895,000
6375061	Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits	Craig T. Clyne	2002-04-23	$5,829,000
6352191	Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits	Craig T. Clyne	2002-03-05	$14,657,000
6211053	Laser wire bonding for wire embedded dielectrics to integrated circuits	—	2001-04-03	$13,496,000
6159609	Method and apparatus for applying atomized adhesive to a leadframe for chip bonding	—	2000-12-12	$18,289,000
6138891	Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits	Craig T. Clyne	2000-10-31	$7,262,000
6132798	Method for applying atomized adhesive to a leadframe for chip bonding	—	2000-10-17	$9,806,000
6129039	Apparatus for applying atomized adhesive to a leadframe for chip bonding	—	2000-10-10	$23,457,000
6126062	Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits	Craig T. Clyne	2000-10-03	$14,395,000
6105846	Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits	Craig T. Clyne	2000-08-22	$18,671,000
6030711	Method and apparatus for applying atomized adhesive to a leadframe for chip bonding	—	2000-02-29	$20,825,000
6001725	Laser wire bonding for wire embedded dielectrics to integrated circuits	—	1999-12-14	$16,076,000
5996805	Lead frame casing	—	1999-12-07	$11,207,000
5962862	Method and apparatus for verifying the presence or absence of a component	Kevin Gibbons, Edward A. Schrock	1999-10-05	$11,371,000
5956607	Laser wire bonding for wire embedded dielectrics to integrated circuits	—	1999-09-21	$18,661,000
5874322	Method and apparatus for applying atomized adhesive to a leadframe for chip bonding	—	1999-02-23	$21,251,000
5872405	Laser wire bonding for wire embedded dielectrics to integrated circuits	—	1999-02-16	$18,099,000
5836454	Lead frame casing	—	1998-11-17	$9,409,000
5810926	Method and apparatus for applying atomized adhesive to a leadframe for chip bonding	—	1998-09-22	$5,052,000
5731244	Laser wire bonding for wire embedded dielectrics to integrated circuits	—	1998-03-24	$6,624,000

Sven Evers — 25 Patents

Issued Patents All Time

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