| 6921017 |
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits |
Craig T. Clyne |
2005-07-26 |
| 6817823 |
Method, device and system for semiconductor wafer transfer |
Edward R. Fix, William Becia, Douglas R. Farnlund |
2004-11-16 |
| 6709967 |
Laser wire bonding for wire embedded dielectrics to integrated circuits |
— |
2004-03-23 |
| 6634538 |
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits |
Craig T. Clyne |
2003-10-21 |
| 6588649 |
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits |
Craig T. Clyne |
2003-07-08 |
| 6390853 |
Laser wire bonding for wire embedded dielectrics to integrated circuits |
— |
2002-05-21 |
| 6375061 |
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits |
Craig T. Clyne |
2002-04-23 |
| 6352191 |
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits |
Craig T. Clyne |
2002-03-05 |
| 6211053 |
Laser wire bonding for wire embedded dielectrics to integrated circuits |
— |
2001-04-03 |
| 6159609 |
Method and apparatus for applying atomized adhesive to a leadframe for chip bonding |
— |
2000-12-12 |
| 6138891 |
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits |
Craig T. Clyne |
2000-10-31 |
| 6132798 |
Method for applying atomized adhesive to a leadframe for chip bonding |
— |
2000-10-17 |
| 6129039 |
Apparatus for applying atomized adhesive to a leadframe for chip bonding |
— |
2000-10-10 |
| 6126062 |
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits |
Craig T. Clyne |
2000-10-03 |
| 6105846 |
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits |
Craig T. Clyne |
2000-08-22 |
| 6030711 |
Method and apparatus for applying atomized adhesive to a leadframe for chip bonding |
— |
2000-02-29 |
| 6001725 |
Laser wire bonding for wire embedded dielectrics to integrated circuits |
— |
1999-12-14 |
| 5996805 |
Lead frame casing |
— |
1999-12-07 |
| 5962862 |
Method and apparatus for verifying the presence or absence of a component |
Kevin Gibbons, Edward A. Schrock |
1999-10-05 |
| 5956607 |
Laser wire bonding for wire embedded dielectrics to integrated circuits |
— |
1999-09-21 |
| 5874322 |
Method and apparatus for applying atomized adhesive to a leadframe for chip bonding |
— |
1999-02-23 |
| 5872405 |
Laser wire bonding for wire embedded dielectrics to integrated circuits |
— |
1999-02-16 |
| 5836454 |
Lead frame casing |
— |
1998-11-17 |
| 5810926 |
Method and apparatus for applying atomized adhesive to a leadframe for chip bonding |
— |
1998-09-22 |
| 5731244 |
Laser wire bonding for wire embedded dielectrics to integrated circuits |
— |
1998-03-24 |
