Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Laser wire bonding for wire embedded dielectrics to integrated circuits

Laser wire bonding for wire embedded dielectrics to integrated circuits

US Patent 5956607 · Granted Sep 21, 1999

Estimated economic value: $18,661,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Non-conductive and self-leveling leadframe clamp insert for wirebonding integrat2005
Method, device and system for semiconductor wafer transfer2004
Laser wire bonding for wire embedded dielectrics to integrated circuits2004
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrat2003
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrat2003
Laser wire bonding for wire embedded dielectrics to integrated circuits2002
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrat2002
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrat2002
Laser wire bonding for wire embedded dielectrics to integrated circuits2001
Method and apparatus for applying atomized adhesive to a leadframe for chip bond2000
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrat2000
Method for applying atomized adhesive to a leadframe for chip bonding2000