Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7863180 | Through substrate via including variable sidewall profile | Edward C. Cooney, III, Peter J. Lindgren, Anthony K. Stamper | 2011-01-04 |
| 7741226 | Optimal tungsten through wafer via and process of fabricating same | Paul S. Andry, Edward C. Cooney, III, Peter J. Lindgren, Cornelia K. Tsang | 2010-06-22 |