DN

Deepukumar M. Nair

QU Qorvo Us: 6 patents #85 of 457Top 20%
EA E.I. Du Pont De Nemours And: 4 patents #2,229 of 8,010Top 30%
Delphi Technologies: 2 patents #1,417 of 4,124Top 35%
CI Corning Incorporated: 1 patents #2,300 of 3,867Top 60%
GR Georgia Tech Research: 1 patents #1,150 of 2,755Top 45%
WE Wemtec: 1 patents #4 of 7Top 60%
Overall (All Time): #334,442 of 4,157,543Top 9%
14
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12327679 Process for making laminate substrate with sintered components Tarak A. Railkar, Jeffrey Dekosky 2025-06-10
11783998 Process for making laminate substrate with sintered components Tarak A. Railkar, Jeffrey Dekosky 2023-10-10
11551995 Substrate with embedded active thermoelectric cooler Mark C. Woods, Kelly M. Lear, Tarak A. Railkar, Bradford Nelson 2023-01-10
11114363 Electronic package arrangements and related methods Robert Charles Dry, Jeffrey Dekosky 2021-09-07
10906274 Laminate substrate with sintered components Tarak A. Railkar, Jeffrey Dekosky 2021-02-02
10587029 Multi-layer substrate with integrated resonator Jeffrey Dekosky, Scott M. Knapp, Tarak A. Railkar, Lawrence A. Carastro, Timothy G. Kraus 2020-03-10
9579748 Method of fabricating electromagnetic bandgap (EBG) structures for microwave/millimeterwave applications using laser processing of unfired low temperature co-fired ceramic (LTCC) tape Michael Arnett Smith, James M. Parisi, Elizabeth D Hughes, William E. McKinzie, III 2017-02-28
9153863 Low temperature co-fired ceramic (LTCC) system in a package (SiP) configurations for microwave/millimeter wave packaging applications Michael Arnett Smith, Bradley Thrasher, James M. Parisi, Joao Carlos Malerbi, Elizabeth D Hughes 2015-10-06
8742262 Low temperature co-fired ceramic structure for high frequency applications and process for making same Scott E. Gordon, Elizabeth D Hughes, Joao Carlos Malerbi, Kumaran Manikantan Nair, James M. Parisi +2 more 2014-06-03
8633858 Method of manufacturing high frequency receiving and/or transmitting devices from low temperature co-fired ceramic materials and devices made therefrom Kumaran Manikantan Nair, Mark Frederick McCombs, Joao Carlos Malerbi, James M. Parisi 2014-01-21
8391017 Thin-film capacitor structures embedded in semiconductor packages and methods of making David Ross McGregor, Cheong-Wo Hunter Chan, Lynne E. Dellis, Fuhan Liu, Venkatesh Sundaram 2013-03-05
7855685 Microwave communication package Matthew R. Walsh, David W. Zimmerman, Benjamen E. Haffke, Scott D. Brandenburg, Charles I. Delheimer +2 more 2010-12-21
7586444 High-frequency electromagnetic bandgap device and method for making same Carl W. Berlin 2009-09-08
6731853 Multiple fiber chip clamp Robert A. Boudreau, Chris P. Brophy, Lawrence Charles Hughes, Jr., Mark Francis Krol, Songsheng Tan +1 more 2004-05-04