Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8536689 | Integrated circuit package system with multi-surface die attach pad | Antonio B. Dimaano, Jr., Il Kwon Shim, Sheila Rima C. Magno | 2013-09-17 |
| 8293584 | Integrated circuit package system with filled wafer recess | Sheila Rima C. Magno, Ma. Shirley Asoy, Pandi C. Marimuthu | 2012-10-23 |
| 7541222 | Wire sweep resistant semiconductor package and manufacturing method therefor | Sheila Rima C. Magno, Byung Tai Do, Antonio B. Dimaano, Jr. | 2009-06-02 |
| 7141886 | Air pocket resistant semiconductor package | Antonio B. Dimaano, Jr., Byung Tai Do, Sheila Rima C. Magno | 2006-11-28 |
| 6969640 | Air pocket resistant semiconductor package system | Antonio Bambalan DIMAANO JR., Byung Tai Do, Sheila Rima C. Magno | 2005-11-29 |