Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12198982 | Laser dicing for singulation | Michael Todd Wyant, Matthew John Sherbin, Sada Hiroyuki, Shoichi Iriguchi, Genki Yano | 2025-01-14 |
| 11482442 | Subring for semiconductor dies | Matthew John Sherbin, Michael Todd Wyant, Sada Hiroyuki, Shoichi Iriguchi, Genki Yano | 2022-10-25 |
| 11469141 | Laser dicing for singulation | Michael Todd Wyant, Matthew John Sherbin, Sada Hiroyuki, Shoichi Iriguchi, Genki Yano | 2022-10-11 |
| 11171031 | Die matrix expander with partitioned subring | Matthew John Sherbin, Michael Todd Wyant, Hiroyuki Sada, Shoichi Iriguchi, Genki Yano | 2021-11-09 |
| 6445069 | Electroless Ni/Pd/Au metallization structure for copper interconnect substrate and method therefor | Jamin Ling | 2002-09-03 |