| 7551439 |
Fluid cooled electronic assembly |
Bruce A. Myers, Gary E. Oberlin |
2009-06-23 |
| 7538425 |
Power semiconductor package having integral fluid cooling |
Bruce A. Myers, Lester Wilkinson, Erich W. Gerbsch |
2009-05-26 |
| 7365981 |
Fluid-cooled electronic system |
Bruce A. Myers, Henry M. Sanftleben |
2008-04-29 |
| 7215547 |
Integrated cooling system for electronic devices |
Shih-Chia Chang, Bruce A. Myers, Carl W. Berlin, M. Ray Fairchild |
2007-05-08 |
| 7106588 |
Power electronic system with passive cooling |
Gary E. Oberlin, Bruce A. Myers, Thomas A. Degenkolb |
2006-09-12 |
| 6833628 |
Mutli-chip module |
Scott D. Brandenburg, Matthew R. Walsh |
2004-12-21 |
| 6560110 |
Corrosive resistant flip chip thermal management structure |
Bruce A. Myers, Thomas A. Degenkolb, Henry M. Sanftleben |
2003-05-06 |
| 6535396 |
Combination circuit board and segmented conductive bus substrate |
Thomas A. Degenkolb, Bruce A. Myers |
2003-03-18 |
| 6156980 |
Flip chip on circuit board with enhanced heat dissipation and method therefor |
Joanna Berndt, Bruce A. Myers |
2000-12-05 |
| 6045032 |
Method of preventing solder reflow of electrical components during wave soldering |
Stuart E Longgood, Douglas E Gullion, Wayne Anthony Sozansky |
2000-04-04 |
| 5953814 |
Process for producing flip chip circuit board assembly exhibiting enhanced reliability |
Wayne Anthony Sozansky, Michael D. Gibson, Susan Acheson Mack, Michael Patrick Meehan, James M. Rosson +2 more |
1999-09-21 |
