| 9262359 |
Method and system for implementing pipeline flip-flops |
Anurag Tomar, Scot A. Woodward, Adrian Aloysius Hendroff, Dennis Huang |
2016-02-16 |
| 8789005 |
Method and apparatus for efficiently processing an integrated circuit layout |
Kimiko Umino |
2014-07-22 |
| 8782586 |
Method, system, and program product for routing an integrated circuit to be manufactured by doubled patterning |
Abdurrahman Sezginer, Jason Sweis, Vassilios Gerousis, Sozen Yao |
2014-07-15 |
| 8713507 |
Method and apparatus for efficiently inserting fills in an integrated circuit layout |
— |
2014-04-29 |
| 8327300 |
Place and route tool that incorporates a metal-fill mechanism |
Thanh Vinh Vuong, William Kao |
2012-12-04 |
| 8161425 |
Method and system for implementing timing aware metal fill |
Gary Nunn, Inhwan Seo, William Kao, Xiaopeng Dong |
2012-04-17 |
| 8136056 |
Method and system for incorporation of patterns and design rule checking |
Louis K. Scheffer |
2012-03-13 |
| 7900166 |
Method to produce an electrical model of an integrated circuit substrate and related system and article of manufacture |
Vinod Kariat, Xiaopeng Dong |
2011-03-01 |
| 7877713 |
Method and apparatus for substrate noise analysis using substrate tile model and tile grid |
Vinod Kariat, Xiaopeng Dong |
2011-01-25 |
| 7865858 |
Method, system, and article of manufacture for implementing metal-fill with power or ground connection |
Thanh Vinh Vuong, William Kao |
2011-01-04 |
| 7661078 |
Method and system for implementing metal fill |
William Kao, Inhwan Seo, Xiaopeng Dong, Gary Nunn |
2010-02-09 |
| 7574685 |
Method, system, and article of manufacture for reducing via failures in an integrated circuit design |
Xiaopeng Dong, Inhwan Seo, William Kao, Gary Nunn |
2009-08-11 |
| 7328419 |
Place and route tool that incorporates a metal-fill mechanism |
Thanh Vinh Vuong, William Kao |
2008-02-05 |
| 7287324 |
Method, system, and article of manufacture for implementing metal-fill on an integrated circuit |
Thanh Vinh Vuong, William Kao |
2007-10-30 |
| 7231624 |
Method, system, and article of manufacture for implementing metal-fill with power or ground connection |
Thanh Vinh Vuong, William Kao |
2007-06-12 |