VK

Vinod Kariat

CS Cadence Design Systems: 19 patents #45 of 2,263Top 2%
📍 Sunnyvale, CA: #1,340 of 14,302 inventorsTop 10%
🗺 California: #30,698 of 386,348 inventorsTop 8%
Overall (All Time): #239,755 of 4,157,543Top 6%
19
Patents All Time

Issued Patents All Time

Showing 1–19 of 19 patents

Patent #TitleCo-InventorsDate
9129078 Static timing analysis of integrated circuit designs with flexible noise and delay models of circuit stages Igor Keller, King-Ho Tam 2015-09-08
8966421 Static timing analysis methods for integrated circuit designs using a multi-CCC current source model Igor Keller, Joel R. Phillips, King-Ho Tam 2015-02-24
8694934 Method and apparatus for multi-die thermal analysis Eddy Pramono, Yong Zhan 2014-04-08
8631369 Methods, systems, and apparatus for timing and signal integrity analysis of integrated circuits with semiconductor process variations Joel R. Phillips, Igor Keller 2014-01-14
8595669 Flexible noise and delay modeling of circuit stages for static timing analysis of integrated circuit designs Igor Keller, King-Ho Tam 2013-11-26
8566760 Method and apparatus for multi-die thermal analysis Eddy Pramono, Yong Zhan 2013-10-22
8543954 Concurrent noise and delay modeling of circuit stages for static timing analysis of integrated circuit designs Igor Keller, King-Ho Tam 2013-09-24
8543952 Method and apparatus for thermal analysis of through-silicon via (TSV) Eddy Pramono, Yong Zhan 2013-09-24
8533644 Multi-CCC current source models and static timing analysis methods for integrated circuit designs Igor Keller, Joel R. Phillips, King-Ho Tam 2013-09-10
8516420 Sensitivity and static timing analysis for integrated circuit designs using a multi-CCC current source model Igor Keller, Joel R. Phillips, King-Ho Tam 2013-08-20
8504958 Method and apparatus for thermal analysis Eddy Pramono, Yong Zhan 2013-08-06
8201113 Method and apparatus for multi-die thermal analysis Eddy Pramono, Yong Zhan 2012-06-12
8104006 Method and apparatus for thermal analysis Igor Keller, Eddy Pramono 2012-01-24
8103996 Method and apparatus for thermal analysis of through-silicon via (TSV) Eddy Pramono, Yong Zhan 2012-01-24
8104007 Method and apparatus for thermal analysis Eddy Pramono, Yong Zhan 2012-01-24
7900166 Method to produce an electrical model of an integrated circuit substrate and related system and article of manufacture Xiaopeng Dong, David C. Noice 2011-03-01
7882471 Timing and signal integrity analysis of integrated circuits with semiconductor process variations Joel R. Phillips, Igor Keller 2011-02-01
7877713 Method and apparatus for substrate noise analysis using substrate tile model and tile grid Xiaopeng Dong, David C. Noice 2011-01-25
6836873 Static noise analysis with noise window estimation and propagation Kenneth Tseng 2004-12-28