Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9582626 | Using waveform propagation for accurate delay calculation | Igor Keller, Jijun Chen, Nikolay Rubanov | 2017-02-28 |
| 8694934 | Method and apparatus for multi-die thermal analysis | Yong Zhan, Vinod Kariat | 2014-04-08 |
| 8566760 | Method and apparatus for multi-die thermal analysis | Yong Zhan, Vinod Kariat | 2013-10-22 |
| 8543952 | Method and apparatus for thermal analysis of through-silicon via (TSV) | Vinod Kariat, Yong Zhan | 2013-09-24 |
| 8504958 | Method and apparatus for thermal analysis | Vinod Kariat, Yong Zhan | 2013-08-06 |
| 8201113 | Method and apparatus for multi-die thermal analysis | Yong Zhan, Vinod Kariat | 2012-06-12 |
| 8103996 | Method and apparatus for thermal analysis of through-silicon via (TSV) | Vinod Kariat, Yong Zhan | 2012-01-24 |
| 8104006 | Method and apparatus for thermal analysis | Vinod Kariat, Igor Keller | 2012-01-24 |
| 8104007 | Method and apparatus for thermal analysis | Vinod Kariat, Yong Zhan | 2012-01-24 |
| 7024644 | IC signal path resistance estimation method | — | 2006-04-04 |
| 6925619 | IC conductor capacitance estimation method | Chin-Chi Teng | 2005-08-02 |